JPH0173969U - - Google Patents
Info
- Publication number
- JPH0173969U JPH0173969U JP1987168563U JP16856387U JPH0173969U JP H0173969 U JPH0173969 U JP H0173969U JP 1987168563 U JP1987168563 U JP 1987168563U JP 16856387 U JP16856387 U JP 16856387U JP H0173969 U JPH0173969 U JP H0173969U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- adhesive
- copper foil
- small electronic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 239000011889 copper foil Substances 0.000 claims description 4
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図乃至第２図はこの考案の実施例を示し、
第１図イは接着剤を塗布する部分に略正方形の銅
箔部分を設けた状態を示すプリント基板の平面図
、第１図ロは接着剤を塗布する部分に略正方形の
銅箔部分を設けると共にこの銅箔部分の中央部に
接着剤だまりを設けたプリント基板の平面図、第
１図ハは接着剤を塗布する部分に２つの長方形の
銅箔部分を設けたプリント基板の平面図、第２図
は小型電子部品の固定状態を示す側面図、第３図
イおよびロは従来のプリント基板の平面図である
。
主要部分の符号の説明、Ｐ：プリント基板、１
，２：パターン、３，３ａ：銅箔部分、４：接着
剤、５：小型電子部品。
Figures 1 and 2 show an embodiment of this invention,
Figure 1A is a plan view of a printed circuit board showing a state in which an approximately square copper foil portion is provided in the area to which adhesive is applied, and Figure 1B is a plan view of a printed circuit board showing a state in which an approximately square copper foil area is provided in the area to which adhesive is applied. Figure 1C is a plan view of a printed circuit board with an adhesive reservoir provided in the center of the copper foil section. FIG. 2 is a side view showing a state in which small electronic components are fixed, and FIGS. 3A and 3B are plan views of a conventional printed circuit board. Explanation of symbols of main parts, P: Printed circuit board, 1
, 2: Pattern, 3, 3a: Copper foil part, 4: Adhesive, 5: Small electronic component.
Claims (1)
定するようにしたプリント基板において、 プリント基板上の前記接着剤を塗布する部分に
接着力を均一にするための銅箔部分を設けたこと
を特徴とするプリント基板。[Claim for Utility Model Registration] In a printed circuit board on which small electronic components such as chip parts are fixed with adhesive, copper foil is used to make the adhesive force uniform on the part of the printed circuit board where the adhesive is applied. A printed circuit board characterized by having a section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168563U JPH0173969U (en) | 1987-11-05 | 1987-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987168563U JPH0173969U (en) | 1987-11-05 | 1987-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173969U true JPH0173969U (en) | 1989-05-18 |
Family
ID=31457849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987168563U Pending JPH0173969U (en) | 1987-11-05 | 1987-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173969U (en) |
-
1987
- 1987-11-05 JP JP1987168563U patent/JPH0173969U/ja active Pending