JPS63124772U - - Google Patents
Info
- Publication number
- JPS63124772U JPS63124772U JP1476887U JP1476887U JPS63124772U JP S63124772 U JPS63124772 U JP S63124772U JP 1476887 U JP1476887 U JP 1476887U JP 1476887 U JP1476887 U JP 1476887U JP S63124772 U JPS63124772 U JP S63124772U
- Authority
- JP
- Japan
- Prior art keywords
- surface mount
- mount component
- circuit board
- printed circuit
- land
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000006071 cream Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は本考案の一実施例における半田付け工程を示
す図、第３図ａ，ｂ、第４図は本考案の一実施例
におけるクリーム半田の流れを示す図、第５図は
従来例を示す平面図、第６図は従来例における半
田付け工程を示す図、第７図ａ，ｂはそれぞれ従
来例における他の半田付け過程の状態を示す平面
図である。
１……プリント基板本体、３……クリーム半田
、４……チツプ部品、５……紫外線硬化型接着剤
、６……ランド、６ａ……延長部。
Fig. 1 is a plan view showing one embodiment of the present invention;
The figure shows the soldering process in an embodiment of the present invention, Figures 3a, b, and 4 show the flow of cream solder in an embodiment of the present invention, and Figure 5 shows a conventional example. FIG. 6 is a plan view showing a soldering process in the conventional example, and FIGS. 7a and 7b are plan views showing other soldering process states in the conventional example. DESCRIPTION OF SYMBOLS 1... Printed circuit board body, 3... Cream solder, 4... Chip parts, 5... Ultraviolet curing adhesive, 6... Land, 6a... Extension part.
Claims (1)
ト基板において、前記面実装部品の電極が半田付
けされるランドと、前記ランドの一部が装着され
た面実装部品本体と相対向する側に延設された延
長部とを有するプリント基板。 In a printed circuit board on which a surface mount component such as a chip component is mounted, a land to which the electrode of the surface mount component is soldered and a part of the land extend to the side opposite to the surface mount component body on which the surface mount component is mounted. A printed circuit board having an extended portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1476887U JPS63124772U (en) | 1987-02-03 | 1987-02-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1476887U JPS63124772U (en) | 1987-02-03 | 1987-02-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63124772U true JPS63124772U (en) | 1988-08-15 |
Family
ID=30805062
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1476887U Pending JPS63124772U (en) | 1987-02-03 | 1987-02-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63124772U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016530723A (en) * | 2013-09-03 | 2016-09-29 | チザラ リヒトシステーメ ゲーエムベーハーＺｉｚａｌａ Ｌｉｃｈｔｓｙｓｔｅｍｅ ＧｍｂＨ | Position-stable soldering method |
| WO2022113186A1 (en) * | 2020-11-25 | 2022-06-02 | 株式会社Fuji | Electric circuit forming method |
-
1987
- 1987-02-03 JP JP1476887U patent/JPS63124772U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016530723A (en) * | 2013-09-03 | 2016-09-29 | チザラ リヒトシステーメ ゲーエムベーハーＺｉｚａｌａ Ｌｉｃｈｔｓｙｓｔｅｍｅ ＧｍｂＨ | Position-stable soldering method |
| JP2019071427A (en) * | 2013-09-03 | 2019-05-09 | ツェットカーヴェー グループ ゲーエムベーハー | Position stable soldering method |
| WO2022113186A1 (en) * | 2020-11-25 | 2022-06-02 | 株式会社Fuji | Electric circuit forming method |