JPS62197801U - - Google Patents
Info
- Publication number
- JPS62197801U JPS62197801U JP8656886U JP8656886U JPS62197801U JP S62197801 U JPS62197801 U JP S62197801U JP 8656886 U JP8656886 U JP 8656886U JP 8656886 U JP8656886 U JP 8656886U JP S62197801 U JPS62197801 U JP S62197801U
- Authority
- JP
- Japan
- Prior art keywords
- main body
- chip component
- electrodes
- chip
- showing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Coils Or Transformers For Communication (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案によるチツプ部品の一実施例を
示す斜視図、第２図は第１図のチツプ部品を印刷
配線板上に仮固定した状態を示す平面図、第３図
は第１図のチツプ部品の半田付け状態を示す断面
図、第４図は従来のチツプ部品を示す斜視図、第
５図は第４図のチツプ部品を印刷配線板上に仮固
定した状態を示す平面図、第６図は第１図のチツ
プ部品の半田付け状態を示す断面図である。
１，８：チツプ部品、２，９：本体、３ａ，３
ｂ，１０ａ，１０ｂ：電極、４：印刷配線板、５
ａ，５ｂ：導体層、６：接着剤、７ａ，７ｂ：半
田。
FIG. 1 is a perspective view showing an embodiment of the chip component according to the present invention, FIG. 2 is a plan view showing the chip component shown in FIG. 1 temporarily fixed on a printed wiring board, and FIG. 4 is a perspective view showing a conventional chip component, and FIG. 5 is a plan view showing the chip component shown in FIG. 4 temporarily fixed on a printed wiring board. FIG. 6 is a cross-sectional view showing the soldered state of the chip component shown in FIG. 1. 1, 8: Chip parts, 2, 9: Main body, 3a, 3
b, 10a, 10b: electrode, 4: printed wiring board, 5
a, 5b: conductor layer, 6: adhesive, 7a, 7b: solder.
Claims (1)
に設けられた電極とを具備するチツプ部品におい
て、 前記本体の上面を電極間に亘る凸状の曲面とし
たことを特徴とするチツプ部品。[Claims for Utility Model Registration] A chip component comprising a main body having a circuit element function and electrodes provided on both end surfaces of the main body, wherein the upper surface of the main body is a convex curved surface extending between the electrodes. Chip parts featuring
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8656886U JPS62197801U (en) | 1986-06-09 | 1986-06-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8656886U JPS62197801U (en) | 1986-06-09 | 1986-06-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62197801U true JPS62197801U (en) | 1987-12-16 |
Family
ID=30942990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8656886U Pending JPS62197801U (en) | 1986-06-09 | 1986-06-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62197801U (en) |
-
1986
- 1986-06-09 JP JP8656886U patent/JPS62197801U/ja active Pending