JPS63193877U - - Google Patents
Info
- Publication number
- JPS63193877U JPS63193877U JP8637587U JP8637587U JPS63193877U JP S63193877 U JPS63193877 U JP S63193877U JP 8637587 U JP8637587 U JP 8637587U JP 8637587 U JP8637587 U JP 8637587U JP S63193877 U JPS63193877 U JP S63193877U
- Authority
- JP
- Japan
- Prior art keywords
- convex portion
- substrate
- surface electrode
- electrode formed
- tip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 4
Description
第１図はこの考案の一実施例を示す部分斜視図
である。第２図は絶縁基板に接続電極を形成する
ときの図解図である。第３図は従来の回路基板の
一例を示す部分斜視図である。
図において、１０は回路基板、１２は絶縁基板
、１４は凹部、１６は凸部、１８は表面電極、２
０は接続電極を示す。
FIG. 1 is a partial perspective view showing an embodiment of this invention. FIG. 2 is an illustrative view when forming connection electrodes on an insulating substrate. FIG. 3 is a partial perspective view showing an example of a conventional circuit board. In the figure, 10 is a circuit board, 12 is an insulating substrate, 14 is a recessed part, 16 is a convex part, 18 is a surface electrode, 2
0 indicates a connection electrode.
Claims (1)
凸部に延びる表面電極、および 前記凸部の先端側面に形成され、前記表面電極
に電気的に接続される接続電極を含む、回路基板
。[Claims for Utility Model Registration] A substrate having a concave portion and a convex portion at its end; a surface electrode formed on the main surface of the substrate, one end of which extends to the convex portion; and a surface electrode formed on a side surface of the tip of the convex portion. and a connection electrode electrically connected to the surface electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8637587U JPS63193877U (en) | 1987-06-02 | 1987-06-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8637587U JPS63193877U (en) | 1987-06-02 | 1987-06-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63193877U true JPS63193877U (en) | 1988-12-14 |
Family
ID=30942621
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8637587U Pending JPS63193877U (en) | 1987-06-02 | 1987-06-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63193877U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281794A (en) * | 1989-03-29 | 1990-11-19 | Internatl Business Mach Corp <Ibm> | Multilayer printed circuit board |
-
1987
- 1987-06-02 JP JP8637587U patent/JPS63193877U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02281794A (en) * | 1989-03-29 | 1990-11-19 | Internatl Business Mach Corp <Ibm> | Multilayer printed circuit board |