JPH0224572U - - Google Patents
Info
- Publication number
- JPH0224572U JPH0224572U JP10175388U JP10175388U JPH0224572U JP H0224572 U JPH0224572 U JP H0224572U JP 10175388 U JP10175388 U JP 10175388U JP 10175388 U JP10175388 U JP 10175388U JP H0224572 U JPH0224572 U JP H0224572U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- soldering
- component body
- electronic component
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 5
Description
第１図ａ，ｂ及びｃは、本考案の回路基板の部
品実装構造の一実施例で、電子部品の外観斜視図
、その電子部品を回路基板に実装した側面図及び
正面図、第２図ａ，ｂ及びｃは、本考案の他の実
施例の電子部品の外観斜視図、その電子部品を回
路基板に実装した側方断面図及び正面図、第３図
ａ，ｂ及びｃは従来例の電子部品の外観斜視図、
その電子部品を回路基板に実装した側面図及び正
面図である。
１……電子部品、２……電子部品の電極、４…
…ランド、５……回路基板。
Figures 1a, b, and c show an example of the component mounting structure of the circuit board of the present invention, including an external perspective view of the electronic component, a side view and a front view of the electronic component mounted on the circuit board, and Figure 2. Figures a, b and c are external perspective views of electronic components according to other embodiments of the present invention, a side sectional view and a front view of the electronic components mounted on a circuit board, and Figures a, b and c are conventional examples. External perspective view of electronic components,
FIG. 2 is a side view and a front view of the electronic component mounted on a circuit board. 1...Electronic component, 2...Electrode of electronic component, 4...
...Land, 5...Circuit board.
Claims (1)
子部品本体の両端に形成した半田付け電極を半田
付けしてなる回路基板の部品実装部において、前
記電子部品本体の両端面の少なくとも下部を除い
た部分に半田付け電極を形成し、部品本体の半田
付け電極より下の部分を半田付けランドの間に嵌
合して、同部品本体の底面を回路基板の上面にほ
ぼ当接させたことを特徴とする回路基板の部品実
装構造。 In a component mounting portion of a circuit board in which soldering electrodes formed at both ends of an electronic component body are soldered to soldering lands formed on the circuit board, at least the lower portions of both end faces of the electronic component body are excluded. A feature is that a soldering electrode is formed on the part, and the part of the component body below the soldering electrode is fitted between the soldering lands, so that the bottom surface of the component body is almost in contact with the top surface of the circuit board. Component mounting structure of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10175388U JPH0224572U (en) | 1988-07-30 | 1988-07-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10175388U JPH0224572U (en) | 1988-07-30 | 1988-07-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0224572U true JPH0224572U (en) | 1990-02-19 |
Family
ID=31331039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10175388U Pending JPH0224572U (en) | 1988-07-30 | 1988-07-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0224572U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04115526U (en) * | 1991-03-29 | 1992-10-14 | 三菱マテリアル株式会社 | Throwaway cutter |
-
1988
- 1988-07-30 JP JP10175388U patent/JPH0224572U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04115526U (en) * | 1991-03-29 | 1992-10-14 | 三菱マテリアル株式会社 | Throwaway cutter |