JPH0323916U - - Google Patents
Info
- Publication number
- JPH0323916U JPH0323916U JP8269189U JP8269189U JPH0323916U JP H0323916 U JPH0323916 U JP H0323916U JP 8269189 U JP8269189 U JP 8269189U JP 8269189 U JP8269189 U JP 8269189U JP H0323916 U JPH0323916 U JP H0323916U
- Authority
- JP
- Japan
- Prior art keywords
- mount component
- surface mount
- reflow soldering
- view
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 6
- 230000001154 acute effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の実施例を示すリードレス表面
実装部品の斜視図、第２図は第１図のＢ−Ｂ線断
面図、第３図は本考案の表面実装部品を印刷配線
板上にリフロー半田付け前の状態を示す斜視図、
第４図は本考案の表面実装部品を印刷配線板上に
リフロー半田付け後の状態を示す斜視図、第５図
は従来のリードレス表面実装部品の斜視図、第６
図はそのリードレス表面実装部品のリフロー半田
付け前の状態を示す斜視図、第７図はそのリード
レス表面実装部品のリフロー半田付け後の状態を
示す斜視図、第８図は第７図のＡ−Ａ線断面図、
第９図は従来技術の問題を示す断面図、第１０図
はマンハツタン現象を解析する断面図である。
１２……部品電極、１２ａ……底面電極、１２
ｂ……側面電極、１３……部品搭載パツド、１５
……半田、１５′……フイレツト、１６……印刷
配線板、１７……リードレス表面実装部品。
Fig. 1 is a perspective view of a leadless surface mount component showing an embodiment of the present invention, Fig. 2 is a sectional view taken along line B-B of Fig. 1, and Fig. 3 shows the surface mount component of the present invention on a printed wiring board. A perspective view showing the state before reflow soldering,
Figure 4 is a perspective view showing the surface mount component of the present invention after reflow soldering on a printed wiring board, Figure 5 is a perspective view of a conventional leadless surface mount component, and Figure 6 is a perspective view of a conventional leadless surface mount component.
The figure is a perspective view showing the state of the leadless surface mount component before reflow soldering, FIG. 7 is a perspective view showing the state of the leadless surface mount component after reflow soldering, and FIG. 8 is the same as in FIG. A-A line sectional view,
FIG. 9 is a cross-sectional view showing a problem in the prior art, and FIG. 10 is a cross-sectional view for analyzing the Manhattan phenomenon. 12...Component electrode, 12a...Bottom electrode, 12
b...Side electrode, 13...Component mounting pad, 15
...Solder, 15'...Fillet, 16...Printed wiring board, 17...Leadless surface mount component.
Claims (1)
け用表面実装部品において、 表面実装部品の側面に形成された電国面が該表
面実装部品の底面及びリフロー半田付けを行う印
刷配線板に配置した時の印刷配線板面と鋭角を成
すように傾斜角をまもつて形成することを特徴と
するリードレス表面実装部品構造。[Scope of Claim for Utility Model Registration] In a surface mount component for reflow soldering having a plurality of leadless electrodes, an electrically conductive surface formed on the side surface of the surface mount component is printed on the bottom surface of the surface mount component for reflow soldering. A leadless surface mount component structure characterized by being formed at an angle of inclination to form an acute angle with the surface of a printed wiring board when placed on a wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8269189U JPH0323916U (en) | 1989-07-15 | 1989-07-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8269189U JPH0323916U (en) | 1989-07-15 | 1989-07-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0323916U true JPH0323916U (en) | 1991-03-12 |
Family
ID=31629727
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8269189U Pending JPH0323916U (en) | 1989-07-15 | 1989-07-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0323916U (en) |
-
1989
- 1989-07-15 JP JP8269189U patent/JPH0323916U/ja active Pending
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