JPH0399467U - - Google Patents

Info

Publication number
JPH0399467U
JPH0399467U JP875090U JP875090U JPH0399467U JP H0399467 U JPH0399467 U JP H0399467U JP 875090 U JP875090 U JP 875090U JP 875090 U JP875090 U JP 875090U JP H0399467 U JPH0399467 U JP H0399467U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
conductor pattern
pattern
grounding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP875090U
Other languages
Japanese (ja)
Other versions
JP2503565Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990008750U priority Critical patent/JP2503565Y2/en
Publication of JPH0399467U publication Critical patent/JPH0399467U/ja
Application granted granted Critical
Publication of JP2503565Y2 publication Critical patent/JP2503565Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の実装前の斜視図、
第２図は実装時における要部の平面図、第３図は
第２図のＡ−Ａ線断面図、第４図は従来の実装構
造の一部の平面図、第５図は第４図のＢ−Ｂ線断
面図である。 １……プリント配線基板、２……絶縁基板、３
……接地用導体パターン、４……固定用導体パタ
ーン、５……電極用導体パターン、６……切込み
溝、１０……実装部品、１１……電極リード、１
２……固定リード、２０……半田。 FIG. 1 is a perspective view of an embodiment of the present invention before implementation;
Fig. 2 is a plan view of the main parts during mounting, Fig. 3 is a sectional view taken along line A-A in Fig. 2, Fig. 4 is a plan view of a part of the conventional mounting structure, and Fig. 5 is Fig. 4. FIG. 1...Printed wiring board, 2...Insulating board, 3
... Conductor pattern for grounding, 4 ... Conductor pattern for fixing, 5 ... Conductor pattern for electrode, 6 ... Cut groove, 10 ... Mounting component, 11 ... Electrode lead, 1
2...Fixed lead, 20...Solder.

Claims (1)

【実用新案登録請求の範囲】 １ プリント配線基板に形成した導体パターンに
実装部品に設けた固定リードを半田リフローによ
り実装する構造において、前記導体パターンには
実装部品の外面に沿つた切込み溝を形成したこと
を特徴とするプリント配線基板の部品実装構造。 ２ 導体パターンは接地用導体パターンに連結さ
れて形成され、この接地用導体パターンとの連結
部において、接地パターンの幅方向両側に切込み
溝を形成してなる実用新案登録請求の範囲第１項
記載のプリント配線基板の部品実装構造。[Claims for Utility Model Registration] 1. In a structure in which a fixed lead provided on a mounted component is mounted on a conductive pattern formed on a printed wiring board by solder reflow, a cut groove is formed in the conductive pattern along the outer surface of the mounted component. A component mounting structure of a printed wiring board characterized by the following. 2. The conductor pattern is formed by being connected to a grounding conductor pattern, and cut grooves are formed on both sides of the grounding pattern in the width direction at the connection part with the grounding conductor pattern. Component mounting structure of printed wiring board.
JP1990008750U 1990-01-31 1990-01-31 Printed circuit board component mounting structure Expired - Lifetime JP2503565Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990008750U JP2503565Y2 (en) 1990-01-31 1990-01-31 Printed circuit board component mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990008750U JP2503565Y2 (en) 1990-01-31 1990-01-31 Printed circuit board component mounting structure

Publications (2)

Publication Number Publication Date
JPH0399467U true JPH0399467U (en) 1991-10-17
JP2503565Y2 JP2503565Y2 (en) 1996-07-03

Family

ID=31512370

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990008750U Expired - Lifetime JP2503565Y2 (en) 1990-01-31 1990-01-31 Printed circuit board component mounting structure

Country Status (1)

Country Link
JP (1) JP2503565Y2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8605446B2 (en) 2011-03-16 2013-12-10 Kabushiki Kaisha Toshiba Electronic apparatus

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116273U (en) * 1984-01-11 1985-08-06 株式会社東芝 printed wiring board
JPH01189195A (en) * 1988-01-25 1989-07-28 Sumitomo Electric Ind Ltd Electrode for mounting electric element

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60116273U (en) * 1984-01-11 1985-08-06 株式会社東芝 printed wiring board
JPH01189195A (en) * 1988-01-25 1989-07-28 Sumitomo Electric Ind Ltd Electrode for mounting electric element

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8605446B2 (en) 2011-03-16 2013-12-10 Kabushiki Kaisha Toshiba Electronic apparatus

Also Published As

Publication number Publication date
JP2503565Y2 (en) 1996-07-03

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Legal Events

Date Code Title Description
EXPY Cancellation because of completion of term