JPS6196564U - - Google Patents
Info
- Publication number
- JPS6196564U JPS6196564U JP18071984U JP18071984U JPS6196564U JP S6196564 U JPS6196564 U JP S6196564U JP 18071984 U JP18071984 U JP 18071984U JP 18071984 U JP18071984 U JP 18071984U JP S6196564 U JPS6196564 U JP S6196564U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- conductor
- substrate
- solder resist
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims 4
- 239000010409 thin film Substances 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図は本考案の一実施例における要部を拡大
して示した斜視図、第２図及び第３図はそれぞれ
従来のプリント配線板の要部を拡大して示した斜
視図である。
符号説明、１…配線板基板、２…銅箔、３…ソ
ルダーレジスト、４…穴、５…銅箔２の切欠、６
…ソルダーレジスト３の延長部、７…銅箔２の端
面、８…端面７の後退部。
FIG. 1 is an enlarged perspective view of the main parts of an embodiment of the present invention, and FIGS. 2 and 3 are enlarged perspective views of the main parts of a conventional printed wiring board. Description of symbols, 1... Wiring board substrate, 2... Copper foil, 3... Solder resist, 4... Hole, 5... Notch in copper foil 2, 6
. . . Extended portion of solder resist 3, 7. End surface of copper foil 2, 8. Recessed portion of end surface 7.
Claims (1)
し、部品を搭載するために前記基板及び導体を貫
通するよう穴を設け、該穴及びその周辺の導体部
を少なくとも除いて、ソルダーレジストを塗布し
たプリント配線板において、前記穴の周辺の導体
部を穴の内側面より一部後退させることにより、
前記基板の一部を露出させ、前記ソルダーレジス
トを該露出部まで延長して塗布するようにしたこ
とを特徴とするプリント配線板。 A wiring pattern was formed using a thin film conductor on an insulating substrate, a hole was formed to penetrate the substrate and the conductor in order to mount the component, and a solder resist was applied to at least the hole and the surrounding conductor part. In the printed wiring board, by partially recessing the conductor portion around the hole from the inner surface of the hole,
A printed wiring board characterized in that a part of the substrate is exposed and the solder resist is applied extending to the exposed part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18071984U JPS6196564U (en) | 1984-11-30 | 1984-11-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18071984U JPS6196564U (en) | 1984-11-30 | 1984-11-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6196564U true JPS6196564U (en) | 1986-06-21 |
Family
ID=30738275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18071984U Pending JPS6196564U (en) | 1984-11-30 | 1984-11-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6196564U (en) |
-
1984
- 1984-11-30 JP JP18071984U patent/JPS6196564U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6196564U (en) | ||
| JPS6020163U (en) | printed wiring board | |
| JPS61207077U (en) | ||
| JPS61121774U (en) | ||
| JPS6382964U (en) | ||
| JPS63184576U (en) | ||
| JPH0328775U (en) | ||
| JPH01179460U (en) | ||
| JPS61127671U (en) | ||
| JPS58147274U (en) | printed wiring board | |
| JPS63182583U (en) | ||
| JPS61100168U (en) | ||
| JPS61203581U (en) | ||
| JPS62116572U (en) | ||
| JPH0165179U (en) | ||
| JPH01146578U (en) | ||
| JPH02142567U (en) | ||
| JPS63137975U (en) | ||
| JPH02127066U (en) | ||
| JPS62188174U (en) | ||
| JPH0348265U (en) | ||
| JPS63141957U (en) | ||
| JPS60121675U (en) | printed wiring board | |
| JPH0479470U (en) | ||
| JPS6236580U (en) |