JPH02127066U - - Google Patents
Info
- Publication number
- JPH02127066U JPH02127066U JP3558689U JP3558689U JPH02127066U JP H02127066 U JPH02127066 U JP H02127066U JP 3558689 U JP3558689 U JP 3558689U JP 3558689 U JP3558689 U JP 3558689U JP H02127066 U JPH02127066 U JP H02127066U
- Authority
- JP
- Japan
- Prior art keywords
- mounting land
- circuit board
- wiring conductor
- protective film
- surface mount
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 3
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000003014 reinforcing effect Effects 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図ａは本考案による回路基板の一実施例を
示す斜視図、同図ｂはそのＡ−Ａ′線上の断面図
である。第２図ａは従来の回路基板を示す斜視図
、同図ｂはそのＡ−Ａ′線上の断面図である。
符号の説明、１…絶縁基板、２…配線導体パタ
ーン、３…ＮＣ導体パターン、４…スルーホール
、５…基板反対面の導体パターン、６…絶縁性保
護膜。
FIG. 1a is a perspective view showing an embodiment of a circuit board according to the present invention, and FIG. 1b is a sectional view taken along the line A-A'. FIG. 2a is a perspective view of a conventional circuit board, and FIG. 2b is a sectional view taken along the line AA'. Explanation of the symbols: 1... Insulating substrate, 2... Wiring conductor pattern, 3... NC conductor pattern, 4... Through hole, 5... Conductor pattern on the opposite side of the substrate, 6... Insulating protective film.
Claims (1)
る配線導体パターンを形成し、上記部品取付けラ
ンドに面実装部品の接続端子を半田付けするため
の、配線導体電極部を残して絶縁性保護膜を被覆
してなる回路基板において、上記配線導体パター
ンの面実装部品取付けランドの面積を接続に使用
される上記配線導体電極部の面積よりも拡大して
、上記保護膜が上記取付けランドの周辺部をも被
覆するようにしかつ、上記基板と上記取付けラン
ドの接続補強手段として上記取付けランドの面積
拡大部分に少なくとも１個のスルーホールを設け
たことを特徴とする、回路基板。 A wiring conductor pattern having a surface mount component mounting land is formed on an insulating substrate, and an insulating protective film is covered with an insulating protective film leaving a wiring conductor electrode portion for soldering the connection terminal of the surface mount component to the component mounting land. In the circuit board formed by the circuit board, the area of the surface mount component mounting land of the wiring conductor pattern is larger than the area of the wiring conductor electrode part used for connection, and the protective film also covers the peripheral part of the mounting land. 1. A circuit board, characterized in that the circuit board is covered with at least one through hole in an enlarged area portion of the mounting land as means for reinforcing the connection between the board and the mounting land.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3558689U JPH02127066U (en) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3558689U JPH02127066U (en) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02127066U true JPH02127066U (en) | 1990-10-19 |
Family
ID=31541069
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3558689U Pending JPH02127066U (en) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02127066U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138979A (en) * | 1980-03-31 | 1981-10-29 | Nippon Electric Co | Circuit board |
-
1989
- 1989-03-30 JP JP3558689U patent/JPH02127066U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56138979A (en) * | 1980-03-31 | 1981-10-29 | Nippon Electric Co | Circuit board |