JPS6240873U - - Google Patents
Info
- Publication number
- JPS6240873U JPS6240873U JP13078385U JP13078385U JPS6240873U JP S6240873 U JPS6240873 U JP S6240873U JP 13078385 U JP13078385 U JP 13078385U JP 13078385 U JP13078385 U JP 13078385U JP S6240873 U JPS6240873 U JP S6240873U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- annular portion
- annular
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図〜第３図は本考案の実施例の説明図で、
第１図は部品取付け前の印刷配線板の平面図、第
２図は第１図のＢ―Ｂ線の断面図、第３図は印刷
配線板に部品を取付けた状態を示す断面図、第４
図〜第６図は従来例の説明図で、第４図は部品取
付け前の印刷配線板の平面図、第５図は第４図の
Ａ―Ａ線の断面図、第６図は印刷配線板に部品を
取付けた状態を示す断面図である。
１……絶縁板、２，４……半田付パターン、３
，５……環状部、６……部品取付孔、Ｐ……印刷
配線板、８……部品の端子、１０，１１……半田
、１２……被覆体。
Figures 1 to 3 are explanatory diagrams of embodiments of the present invention,
Figure 1 is a plan view of the printed wiring board before parts are attached, Figure 2 is a cross-sectional view taken along line B-B in Figure 1, Figure 3 is a cross-sectional view showing the printed wiring board with parts attached, 4
Figures 6 to 6 are explanatory diagrams of the conventional example, Figure 4 is a plan view of the printed wiring board before parts are attached, Figure 5 is a sectional view taken along line A-A in Figure 4, and Figure 6 is the printed wiring board. It is a sectional view showing a state where parts are attached to a plate. 1... Insulating plate, 2, 4... Soldering pattern, 3
, 5... Annular portion, 6... Component mounting hole, P... Printed wiring board, 8... Component terminal, 10, 11... Solder, 12... Covering body.
Claims (1)
ターンを、他面に一部に環状部を有する半田付パ
ターンを設け、両環状部を対向配置し、両環状部
を貫通して部品取付孔を設けた印刷配線板の、前
記部品取付孔に部品の端子を挿入し、該端子を絶
縁板の両環状部に半田付けしてなる印刷配線板に
おいて、前記印刷配線板の部品取付面側に設けた
環状部に、前記取付孔から外方に向けて延伸する
半田の被着しない被覆体を設けたことを特徴とす
る印刷配線板。 A soldering pattern that partially has an annular portion is provided on one side of the insulating plate, and a soldering pattern that partially includes an annular portion is provided on the other side, and both annular portions are placed opposite each other, and parts are attached by penetrating both annular portions. In a printed wiring board formed by inserting component terminals into the component mounting holes of a printed wiring board provided with holes and soldering the terminals to both annular portions of an insulating plate, the component mounting surface side of the printed wiring board 1. A printed wiring board characterized in that a solder-free coating is provided on an annular portion provided in the mounting hole and extends outward from the mounting hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13078385U JPS6240873U (en) | 1985-08-29 | 1985-08-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13078385U JPS6240873U (en) | 1985-08-29 | 1985-08-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6240873U true JPS6240873U (en) | 1987-03-11 |
Family
ID=31028615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13078385U Pending JPS6240873U (en) | 1985-08-29 | 1985-08-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6240873U (en) |
-
1985
- 1985-08-29 JP JP13078385U patent/JPS6240873U/ja active Pending