JPH031474U - - Google Patents
Info
- Publication number
- JPH031474U JPH031474U JP5946389U JP5946389U JPH031474U JP H031474 U JPH031474 U JP H031474U JP 5946389 U JP5946389 U JP 5946389U JP 5946389 U JP5946389 U JP 5946389U JP H031474 U JPH031474 U JP H031474U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- circuit board
- printed circuit
- component land
- wiring pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000002940 repellent Effects 0.000 claims description 2
- 239000005871 repellent Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
Description
第１図は本考案の一実施例に係るプリント基板
の斜視図、第２図は第１図のＡ−Ａ線断面図、第
３図は第２図のプリント基板に電子部品を搭載し
て示す構成図、第４図は第１図のプリント基板の
変形例を示す斜視図、第５図は第４図のＢ−Ｂ線
断面図、第６図は従来のプリント基板を示す斜視
図である。
１１……プリント基板、１２……部品ランド、
１２ａ……接続パターン、１３……スルーホール
、１３ａ……メツキ、１４……ハンダ撥じき部、
１５……配線パターン、１６……電子部品。
Fig. 1 is a perspective view of a printed circuit board according to an embodiment of the present invention, Fig. 2 is a sectional view taken along line A-A in Fig. 1, and Fig. 3 is a diagram showing electronic components mounted on the printed circuit board of Fig. 2. 4 is a perspective view showing a modified example of the printed circuit board shown in FIG. 1, FIG. 5 is a sectional view taken along line B-B in FIG. 4, and FIG. 6 is a perspective view showing a conventional printed circuit board. be. 11...Printed circuit board, 12...Component land,
12a... connection pattern, 13... through hole, 13a... plating, 14... solder repellent part,
15...Wiring pattern, 16...Electronic component.
Claims (1)
る部品ランドが設けられ、該部品ランドを他面側
の配線パターンに電気的に接続したプリント基板
において、上記部品ランド内位置にスルーホール
を形成するとともに、該スルーホールの一面側開
口周辺部をハンダ撥じき領域に形成し、スルーホ
ールの他面側開口を上記配線パターンと電気的に
接続させることを特徴とするプリント基板。 A through hole is formed at a position within the component land in a printed circuit board in which a component land is provided to electrically connect electronic components mounted on one side, and the component land is electrically connected to a wiring pattern on the other side. At the same time, a printed circuit board characterized in that a peripheral part of the opening on one side of the through hole is formed in a solder repellent area, and an opening on the other side of the through hole is electrically connected to the wiring pattern.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5946389U JPH031474U (en) | 1989-05-22 | 1989-05-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5946389U JPH031474U (en) | 1989-05-22 | 1989-05-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH031474U true JPH031474U (en) | 1991-01-09 |
Family
ID=31585976
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5946389U Pending JPH031474U (en) | 1989-05-22 | 1989-05-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH031474U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6115392A (en) * | 1984-07-02 | 1986-01-23 | ソニー株式会社 | Printed circuit board |
| JPS6234463B2 (en) * | 1982-03-31 | 1987-07-27 | Nippon Kokan Kk |
-
1989
- 1989-05-22 JP JP5946389U patent/JPH031474U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6234463B2 (en) * | 1982-03-31 | 1987-07-27 | Nippon Kokan Kk | |
| JPS6115392A (en) * | 1984-07-02 | 1986-01-23 | ソニー株式会社 | Printed circuit board |