JPH0316375U - - Google Patents
Info
- Publication number
- JPH0316375U JPH0316375U JP7487089U JP7487089U JPH0316375U JP H0316375 U JPH0316375 U JP H0316375U JP 7487089 U JP7487089 U JP 7487089U JP 7487089 U JP7487089 U JP 7487089U JP H0316375 U JPH0316375 U JP H0316375U
- Authority
- JP
- Japan
- Prior art keywords
- bayer
- lead
- circuit board
- printed circuit
- solder resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 239000004020 conductor Substances 0.000 description 1
Description
第１図は本考案の一実施例を示す断面図、第２
図は従来例を示す断面図である。
１……プリント基板、２……部品、４……リー
ド、６……バイヤーホール、７……半田、８……
導体、９……ソルダ・レジスト。
Fig. 1 is a sectional view showing one embodiment of the present invention;
The figure is a sectional view showing a conventional example. 1...Printed circuit board, 2...Parts, 4...Lead, 6...Buyer hole, 7...Solder, 8...
Conductor, 9...Solder resist.
Claims (1)
て、前記リード付近にバイヤーホールを有するも
のにおいて、バイヤーホールの少なくとも部品装
着面側の開口部周縁にソルダ・レジストを形成し
たことを特徴とするプリント基板。 1. A printed circuit board on which a leaded component is mounted, which has a bayer hole near the lead, characterized in that a solder resist is formed at least around the opening of the bayer hole on the component mounting surface side.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7487089U JPH0316375U (en) | 1989-06-28 | 1989-06-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7487089U JPH0316375U (en) | 1989-06-28 | 1989-06-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316375U true JPH0316375U (en) | 1991-02-19 |
Family
ID=31614943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7487089U Pending JPH0316375U (en) | 1989-06-28 | 1989-06-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316375U (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS549770A (en) * | 1977-06-24 | 1979-01-24 | Hitachi Ltd | Screen print process for print wire board |
| JPS5691496A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Method of manufacturing printed board with solder resist |
| JPS61241995A (en) * | 1985-04-18 | 1986-10-28 | 三菱電機株式会社 | Printed wiring board |
-
1989
- 1989-06-28 JP JP7487089U patent/JPH0316375U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS549770A (en) * | 1977-06-24 | 1979-01-24 | Hitachi Ltd | Screen print process for print wire board |
| JPS5691496A (en) * | 1979-12-26 | 1981-07-24 | Fujitsu Ltd | Method of manufacturing printed board with solder resist |
| JPS61241995A (en) * | 1985-04-18 | 1986-10-28 | 三菱電機株式会社 | Printed wiring board |