JPH02142546U - - Google Patents
Info
- Publication number
- JPH02142546U JPH02142546U JP5082689U JP5082689U JPH02142546U JP H02142546 U JPH02142546 U JP H02142546U JP 5082689 U JP5082689 U JP 5082689U JP 5082689 U JP5082689 U JP 5082689U JP H02142546 U JPH02142546 U JP H02142546U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit package
- board
- mounting structure
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す斜視図、第２
図は第１図実施例に用いられる集積回路パツケー
ジを示す斜視図、第３図Ａは第２図の集積回路パ
ツケージの平面図、第３図Ｂは第２図の集積回路
パツケージの側面図、第４図は従来の集積回路パ
ツケージの斜視図、第５図は第４図の集積回路パ
ツケージの実装状態を示す平面図である。
１０……ケース部、１１……リード部、１２…
…凸部、１３……基板、１４……マイクロストリ
ツプ線路、１５……スルーホール。
Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a perspective view showing the integrated circuit package used in the embodiment of FIG. 1, FIG. 3A is a plan view of the integrated circuit package of FIG. 2, and FIG. 3B is a side view of the integrated circuit package of FIG. FIG. 4 is a perspective view of a conventional integrated circuit package, and FIG. 5 is a plan view showing a state in which the integrated circuit package of FIG. 4 is mounted. 10...Case part, 11...Lead part, 12...
...Convex portion, 13...Substrate, 14...Microstrip line, 15...Through hole.
Claims (1)
ード部を基板の回路パターン部に沿わせて配設し
て集積回路パツケージを基板に実装する集積回路
パツケージの実装構造において、前記基板の回路
パターン部に凹部を形成すると共に、該凹部に嵌
合する凸部を前記集積回路パツケージのリード部
に形成してあることを特徴とする集積回路パツケ
ージの実装構造。 In an integrated circuit package mounting structure in which an integrated circuit package is mounted on a board by disposing a lead part protruding from a case part of the integrated circuit package along a circuit pattern part of the board, a recess is formed in the circuit pattern part of the board. A mounting structure for an integrated circuit package, characterized in that a convex portion that fits into the concave portion is formed on the lead portion of the integrated circuit package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5082689U JPH02142546U (en) | 1989-04-28 | 1989-04-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5082689U JPH02142546U (en) | 1989-04-28 | 1989-04-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02142546U true JPH02142546U (en) | 1990-12-04 |
Family
ID=31569714
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5082689U Pending JPH02142546U (en) | 1989-04-28 | 1989-04-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02142546U (en) |
-
1989
- 1989-04-28 JP JP5082689U patent/JPH02142546U/ja active Pending