JPS6420738U - - Google Patents
Info
- Publication number
- JPS6420738U JPS6420738U JP1987115453U JP11545387U JPS6420738U JP S6420738 U JPS6420738 U JP S6420738U JP 1987115453 U JP1987115453 U JP 1987115453U JP 11545387 U JP11545387 U JP 11545387U JP S6420738 U JPS6420738 U JP S6420738U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- wiring board
- printed wiring
- resin
- bent portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図は本考案の実施例を示すプラスチツクピ
ングリツドアレーの断面図である。
１……プリント配線板、２……リードピン、３
……集積回路、４……封止用枠、４ａ……折曲形
状部、４ｂ……貫通穴、５……接着剤。
FIG. 1 is a sectional view of a plastic pin grid array showing an embodiment of the present invention. 1...Printed wiring board, 2...Lead pin, 3
... integrated circuit, 4 ... sealing frame, 4a ... bent shape section, 4b ... through hole, 5 ... adhesive.
Claims (1)
を用いて樹脂封止する集積回路装置に於いて、前
記封止枠は断面Ｌ字状の折曲形状部を有し、前記
封止枠をプリント配線板に装着した状態にて、前
記折曲形状部がプリント配線板の端面に覆うこと
を特徴とした集積回路の樹脂封止構造。 In an integrated circuit device in which an integrated circuit mounted on a printed wiring board is resin-sealed using a sealing frame, the sealing frame has a bent portion having an L-shaped cross section; A resin-sealed structure for an integrated circuit, wherein the bent portion covers an end surface of the printed wiring board when the integrated circuit is mounted on the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115453U JPS6420738U (en) | 1987-07-28 | 1987-07-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987115453U JPS6420738U (en) | 1987-07-28 | 1987-07-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6420738U true JPS6420738U (en) | 1989-02-01 |
Family
ID=31357125
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987115453U Pending JPS6420738U (en) | 1987-07-28 | 1987-07-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6420738U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7869435B2 (en) | 2003-08-29 | 2011-01-11 | Fujitsu Limited | Communication control system |
-
1987
- 1987-07-28 JP JP1987115453U patent/JPS6420738U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7869435B2 (en) | 2003-08-29 | 2011-01-11 | Fujitsu Limited | Communication control system |