JPH0236045U - - Google Patents
Info
- Publication number
- JPH0236045U JPH0236045U JP11568388U JP11568388U JPH0236045U JP H0236045 U JPH0236045 U JP H0236045U JP 11568388 U JP11568388 U JP 11568388U JP 11568388 U JP11568388 U JP 11568388U JP H0236045 U JPH0236045 U JP H0236045U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- positioned above
- circuit chip
- internal structure
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の実施例を示す集積回路の内部
構造図、第２図は従来の半導体集積回路の内部構
造図である。
１……プラスチツクモールド、２……リードフ
レーム、３……集積回路チツプ、４……集積回路
チツプ表面、５……リード、６……外来ノイズ、
７……実装プリント、８……リード挿入用ホール
、９……プリント配線。
FIG. 1 is a diagram of the internal structure of an integrated circuit showing an embodiment of the present invention, and FIG. 2 is a diagram of the internal structure of a conventional semiconductor integrated circuit. 1... Plastic mold, 2... Lead frame, 3... Integrated circuit chip, 4... Integrated circuit chip surface, 5... Lead, 6... External noise,
7... Mounting print, 8... Hole for lead insertion, 9... Print wiring.
Claims (1)
封止される集積回路の内部構造において、集積回
路の実装面を最下面の基準として、上方に、集積
回路チツプ次に、該集積回路チツプをマウントし
たリードフレームを位置させることを特徴とした
集積回路。 In the internal structure of an integrated circuit sealed in a dual-in-line plastic mold, the integrated circuit chip is positioned above the mounting surface of the integrated circuit, and then the lead frame on which the integrated circuit chip is mounted is positioned above. An integrated circuit characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11568388U JPH0236045U (en) | 1988-09-01 | 1988-09-01 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11568388U JPH0236045U (en) | 1988-09-01 | 1988-09-01 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0236045U true JPH0236045U (en) | 1990-03-08 |
Family
ID=31357564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11568388U Pending JPH0236045U (en) | 1988-09-01 | 1988-09-01 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0236045U (en) |
-
1988
- 1988-09-01 JP JP11568388U patent/JPH0236045U/ja active Pending
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