JPH01133745U - - Google Patents
Info
- Publication number
- JPH01133745U JPH01133745U JP2827288U JP2827288U JPH01133745U JP H01133745 U JPH01133745 U JP H01133745U JP 2827288 U JP2827288 U JP 2827288U JP 2827288 U JP2827288 U JP 2827288U JP H01133745 U JPH01133745 U JP H01133745U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- zigzag
- spreading
- shaping
- outward
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000007493 shaping process Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
第１図ａ，ｂは本考案の一実施例を示す正面図
及び側面図、第２図は本考案の半導体パツケージ
の自動実装方法を示す図である。
１…樹脂封止部、２…リード、３ａ，３ｂ，３
ｃ…チヤツクユニツト、４…プリント基板、５…
貫通孔。
1A and 1B are a front view and a side view showing an embodiment of the present invention, and FIG. 2 is a diagram showing an automatic mounting method of a semiconductor package according to the present invention. 1...Resin sealing part, 2...Lead, 3a, 3b, 3
c...Chuck unit, 4...Printed circuit board, 5...
Through hole.
Claims (1)
いて、リードを外側に広げて整形することを特徴
とする半導体パツケージ。 A zigzag in-line type semiconductor package characterized by shaping the leads by spreading them outward.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2827288U JPH01133745U (en) | 1988-03-02 | 1988-03-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2827288U JPH01133745U (en) | 1988-03-02 | 1988-03-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01133745U true JPH01133745U (en) | 1989-09-12 |
Family
ID=31251502
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2827288U Pending JPH01133745U (en) | 1988-03-02 | 1988-03-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01133745U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173292A (en) * | 2005-12-19 | 2007-07-05 | Sharp Corp | Type electronic part with lead terminal |
-
1988
- 1988-03-02 JP JP2827288U patent/JPH01133745U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007173292A (en) * | 2005-12-19 | 2007-07-05 | Sharp Corp | Type electronic part with lead terminal |
| JP4486591B2 (en) * | 2005-12-19 | 2010-06-23 | シャープ株式会社 | Lead terminal lead-out type electronic components |