JPS59111052U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS59111052U
JPS59111052U JP388683U JP388683U JPS59111052U JP S59111052 U JPS59111052 U JP S59111052U JP 388683 U JP388683 U JP 388683U JP 388683 U JP388683 U JP 388683U JP S59111052 U JPS59111052 U JP S59111052U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit device
socket
electronic components
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP388683U
Other languages
Japanese (ja)
Inventor
太田　康昌
幹人 田中
Original Assignee
日本電気アイシ−マイコンシステム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気アイシ−マイコンシステム株式会社 filed Critical 日本電気アイシ−マイコンシステム株式会社
Priority to JP388683U priority Critical patent/JPS59111052U/en
Publication of JPS59111052U publication Critical patent/JPS59111052U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のパツケｉジに封入された混成集積回路装
置の断面図、第２図は本考案の一実施例を示す断面図で
ある。 １０１．２０１・・・回路基板１，２０８・・・回路基
板とソケットの接続部、１０２．２０２・・・リード、
１０３．２０３・・・モールド、１０４．２０４・・・
パッケージ、１０５．２０５・・・回路部品、２０６・
・・ソケット、２０７・・・外付回路部品。FIG. 1 is a sectional view of a conventional hybrid integrated circuit device sealed in a package, and FIG. 2 is a sectional view showing an embodiment of the present invention. 101.201...Circuit board 1,208...Connection part between circuit board and socket, 102.202...Lead,
103.203...Mold, 104.204...
Package, 105.205...Circuit parts, 206.
...Socket, 207...External circuit component.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] ケース封入型混成集積回路パッケージの実装上部に、電
子部品接続用のソケットを設ける構造を持つことを特徴
とする混成集積回路装置。A hybrid integrated circuit device characterized by having a structure in which a socket for connecting electronic components is provided on the mounting upper part of a case-enclosed hybrid integrated circuit package.
JP388683U 1983-01-14 1983-01-14 Hybrid integrated circuit device Pending JPS59111052U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP388683U JPS59111052U (en) 1983-01-14 1983-01-14 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP388683U JPS59111052U (en) 1983-01-14 1983-01-14 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS59111052U true JPS59111052U (en) 1984-07-26

Family

ID=30135497

Family Applications (1)

Application Number Title Priority Date Filing Date
JP388683U Pending JPS59111052U (en) 1983-01-14 1983-01-14 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS59111052U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209381A1 (en) * 2021-04-01 2022-10-06 住友電気工業株式会社 Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022209381A1 (en) * 2021-04-01 2022-10-06 住友電気工業株式会社 Semiconductor device

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