JPS60179065U - printed circuit board - Google Patents

printed circuit board

Info

Publication number
JPS60179065U
JPS60179065U JP6626684U JP6626684U JPS60179065U JP S60179065 U JPS60179065 U JP S60179065U JP 6626684 U JP6626684 U JP 6626684U JP 6626684 U JP6626684 U JP 6626684U JP S60179065 U JPS60179065 U JP S60179065U
Authority
JP
Japan
Prior art keywords
printed circuit
circuit board
board
semiconductor device
type semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP6626684U
Other languages
Japanese (ja)
Inventor
林 峰雄
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP6626684U priority Critical patent/JPS60179065U/en
Publication of JPS60179065U publication Critical patent/JPS60179065U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図はフラットパッケージタイプの半導体装置を示す
側面図、第2図は従来の実装方法を示す断面図、第3図
は本考案の一実施例を示す断面図である。 尚、図において、1・・・樹脂モールド層、2・・・外
部リード、3.10・・・プリント回路基板、4°・・
ハンダ、5・・・プリント配線、11・・・ガイドであ
る。
FIG. 1 is a side view showing a flat package type semiconductor device, FIG. 2 is a sectional view showing a conventional mounting method, and FIG. 3 is a sectional view showing an embodiment of the present invention. In the figure, 1...resin mold layer, 2...external lead, 3.10...printed circuit board, 4°...
Solder, 5...Printed wiring, 11...Guide.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] フラットパッケージタイプの半導体装置を実装するプリ
ント回路基板において、上記基板上に実装時に位置決め
用ガイドを設けたことを特徴とするプリント回路基板。
A printed circuit board on which a flat package type semiconductor device is mounted, characterized in that a positioning guide is provided on the board for mounting.
JP6626684U 1984-05-07 1984-05-07 printed circuit board Pending JPS60179065U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6626684U JPS60179065U (en) 1984-05-07 1984-05-07 printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6626684U JPS60179065U (en) 1984-05-07 1984-05-07 printed circuit board

Publications (1)

Publication Number Publication Date
JPS60179065U true JPS60179065U (en) 1985-11-28

Family

ID=30599008

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6626684U Pending JPS60179065U (en) 1984-05-07 1984-05-07 printed circuit board

Country Status (1)

Country Link
JP (1) JPS60179065U (en)

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