JPS5929068U - Positioning structure for chip-type parts - Google Patents
Positioning structure for chip-type partsInfo
- Publication number
- JPS5929068U JPS5929068U JP12475582U JP12475582U JPS5929068U JP S5929068 U JPS5929068 U JP S5929068U JP 12475582 U JP12475582 U JP 12475582U JP 12475582 U JP12475582 U JP 12475582U JP S5929068 U JPS5929068 U JP S5929068U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- positioning structure
- type parts
- type component
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は配線板上にチップ型部品を搭載したところを示
すイは平面図ミロは断面図、第2図は本考案の一実施例
でイは平面図、口、ハ、二はそれぞれ製造過程を示す断
面図である。
図中1は配線板、2はパターン極、2′は配線パターン
、3は予備半田層、4はチップ型部品、5は電極、6は
接着剤、7oはガイド枠パターン、7はガイド枠をそれ
ぞれ示す。Figure 1 shows a chip-type component mounted on a wiring board. A is a plan view, Miro is a cross-sectional view, and Figure 2 is an embodiment of the present invention. It is a sectional view showing a process. In the figure, 1 is a wiring board, 2 is a pattern pole, 2' is a wiring pattern, 3 is a preliminary solder layer, 4 is a chip type component, 5 is an electrode, 6 is an adhesive, 7o is a guide frame pattern, and 7 is a guide frame. Each is shown below.
Claims (1)
の外形寸法にほぼ等しい内枠寸法の絶縁性樹脂よりなる
ガイド枠が形成されてなることを特徴とするチップ型部
品の位置決め構造。A positioning structure for a chip-type component, characterized in that a guide frame made of an insulating resin and having an inner frame size approximately equal to the external dimension of the chip-type component is formed at a mounting position of the chip-type component on a wiring board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12475582U JPS5929068U (en) | 1982-08-18 | 1982-08-18 | Positioning structure for chip-type parts |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12475582U JPS5929068U (en) | 1982-08-18 | 1982-08-18 | Positioning structure for chip-type parts |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5929068U true JPS5929068U (en) | 1984-02-23 |
Family
ID=30284272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12475582U Pending JPS5929068U (en) | 1982-08-18 | 1982-08-18 | Positioning structure for chip-type parts |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5929068U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02127059U (en) * | 1989-03-30 | 1990-10-19 | ||
JP2023523954A (en) * | 2020-04-30 | 2023-06-08 | ツェットカーヴェー グループ ゲーエムベーハー | Barriers to floating SMT components |
-
1982
- 1982-08-18 JP JP12475582U patent/JPS5929068U/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH02127059U (en) * | 1989-03-30 | 1990-10-19 | ||
JP2023523954A (en) * | 2020-04-30 | 2023-06-08 | ツェットカーヴェー グループ ゲーエムベーハー | Barriers to floating SMT components |
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