JPS5929068U - Positioning structure for chip-type parts - Google Patents

Positioning structure for chip-type parts

Info

Publication number
JPS5929068U
JPS5929068U JP12475582U JP12475582U JPS5929068U JP S5929068 U JPS5929068 U JP S5929068U JP 12475582 U JP12475582 U JP 12475582U JP 12475582 U JP12475582 U JP 12475582U JP S5929068 U JPS5929068 U JP S5929068U
Authority
JP
Japan
Prior art keywords
chip
positioning structure
type parts
type component
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12475582U
Other languages
Japanese (ja)
Inventor
敏 遠藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP12475582U priority Critical patent/JPS5929068U/en
Publication of JPS5929068U publication Critical patent/JPS5929068U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は配線板上にチップ型部品を搭載したところを示
すイは平面図ミロは断面図、第2図は本考案の一実施例
でイは平面図、口、ハ、二はそれぞれ製造過程を示す断
面図である。 図中1は配線板、2はパターン極、2′は配線パターン
、3は予備半田層、4はチップ型部品、5は電極、6は
接着剤、7oはガイド枠パターン、7はガイド枠をそれ
ぞれ示す。
Figure 1 shows a chip-type component mounted on a wiring board. A is a plan view, Miro is a cross-sectional view, and Figure 2 is an embodiment of the present invention. It is a sectional view showing a process. In the figure, 1 is a wiring board, 2 is a pattern pole, 2' is a wiring pattern, 3 is a preliminary solder layer, 4 is a chip type component, 5 is an electrode, 6 is an adhesive, 7o is a guide frame pattern, and 7 is a guide frame. Each is shown below.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 配線板上のチップ型部品の搭載位置に、該チップ型部品
の外形寸法にほぼ等しい内枠寸法の絶縁性樹脂よりなる
ガイド枠が形成されてなることを特徴とするチップ型部
品の位置決め構造。
A positioning structure for a chip-type component, characterized in that a guide frame made of an insulating resin and having an inner frame size approximately equal to the external dimension of the chip-type component is formed at a mounting position of the chip-type component on a wiring board.
JP12475582U 1982-08-18 1982-08-18 Positioning structure for chip-type parts Pending JPS5929068U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12475582U JPS5929068U (en) 1982-08-18 1982-08-18 Positioning structure for chip-type parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12475582U JPS5929068U (en) 1982-08-18 1982-08-18 Positioning structure for chip-type parts

Publications (1)

Publication Number Publication Date
JPS5929068U true JPS5929068U (en) 1984-02-23

Family

ID=30284272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12475582U Pending JPS5929068U (en) 1982-08-18 1982-08-18 Positioning structure for chip-type parts

Country Status (1)

Country Link
JP (1) JPS5929068U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127059U (en) * 1989-03-30 1990-10-19
JP2023523954A (en) * 2020-04-30 2023-06-08 ツェットカーヴェー グループ ゲーエムベーハー Barriers to floating SMT components

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02127059U (en) * 1989-03-30 1990-10-19
JP2023523954A (en) * 2020-04-30 2023-06-08 ツェットカーヴェー グループ ゲーエムベーハー Barriers to floating SMT components

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