JPS5920641U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5920641U JPS5920641U JP11552382U JP11552382U JPS5920641U JP S5920641 U JPS5920641 U JP S5920641U JP 11552382 U JP11552382 U JP 11552382U JP 11552382 U JP11552382 U JP 11552382U JP S5920641 U JPS5920641 U JP S5920641U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor device
- resin material
- external leads
- molded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のＤＩＰ半導体装置の外観斜視図、第２図
は従来のＤＩＰ半導体装置をプリント基板に設置した状
態を示す外観斜視図、第３図は本考案に係る半導体装置
の一実施例の外観斜視図、第４図は本考案に係る半導体
装置の他の実施例の外観斜視図、第５図は第４図の半導
体装置をカセットケース内に組み込んだ状態を示す外観
斜視図を示す。
７図中、６：封止樹脂材、７：外部リード、８：り一ド
フレーム、９：孔、１０：カセットケース、１１：位置
決めピン。FIG. 1 is an external perspective view of a conventional DIP semiconductor device, FIG. 2 is an external perspective view showing the conventional DIP semiconductor device installed on a printed circuit board, and FIG. 3 is an embodiment of the semiconductor device according to the present invention. FIG. 4 is an external perspective view of another embodiment of the semiconductor device according to the present invention, and FIG. 5 is an external perspective view showing the semiconductor device of FIG. 4 installed in a cassette case. . In Figure 7, 6: sealing resin material, 7: external lead, 8: lead frame, 9: hole, 10: cassette case, 11: positioning pin.
Claims (1)
ルドしてなる半導体装置において、前記モールドした樹
脂材の一部にて外部リードを支持せしめ、その支持部分
をコネクターとして構成したことを特徴とする半導体装
置＝A semiconductor device in which a semiconductor chip from which external leads are led out is molded with a resin material, characterized in that the external leads are supported by a part of the molded resin material, and the supporting portion is configured as a connector. Semiconductor device =
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11552382U JPS5920641U (en) | 1982-07-28 | 1982-07-28 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11552382U JPS5920641U (en) | 1982-07-28 | 1982-07-28 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5920641U true JPS5920641U (en) | 1984-02-08 |
Family
ID=30266639
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11552382U Pending JPS5920641U (en) | 1982-07-28 | 1982-07-28 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5920641U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5632752A (en) * | 1979-08-23 | 1981-04-02 | Seiko Instr & Electronics Ltd | Parts of segmented electrode |
| JPS5853155B2 (en) * | 1975-07-07 | 1983-11-28 | サンエスセツコウ カブシキガイシヤ | How to prepare the base for floor finishing |
-
1982
- 1982-07-28 JP JP11552382U patent/JPS5920641U/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5853155B2 (en) * | 1975-07-07 | 1983-11-28 | サンエスセツコウ カブシキガイシヤ | How to prepare the base for floor finishing |
| JPS5632752A (en) * | 1979-08-23 | 1981-04-02 | Seiko Instr & Electronics Ltd | Parts of segmented electrode |
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