JPS6045447U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS6045447U
JPS6045447U JP13858383U JP13858383U JPS6045447U JP S6045447 U JPS6045447 U JP S6045447U JP 13858383 U JP13858383 U JP 13858383U JP 13858383 U JP13858383 U JP 13858383U JP S6045447 U JPS6045447 U JP S6045447U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
lead
sealing body
semiconductor device
led out
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13858383U
Other languages
Japanese (ja)
Inventor
谷浦　隆
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP13858383U priority Critical patent/JPS6045447U/en
Publication of JPS6045447U publication Critical patent/JPS6045447U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来のＤＩＰ型半導体集積回路装置の断面図、
第２図は本考案の一実施例を示す断面図、第３図は第２
図で示した装置の実装状態を示す断面図、第４図、第５
図はそれぞれ本考案の他の実施例を示す断面図である。 １．１′・・・・・・樹脂封止体、２，２′・・・・・
・外部引き出しリード、３・・・・・・半導体素子、４
・・・・・・プリント板、５・・・・・・半田。FIG. 1 is a cross-sectional view of a conventional DIP type semiconductor integrated circuit device.
Fig. 2 is a sectional view showing one embodiment of the present invention, and Fig. 3 is a cross-sectional view showing an embodiment of the present invention.
Cross-sectional views showing the mounting state of the device shown in the figures, Figures 4 and 5.
The figures are sectional views showing other embodiments of the present invention. 1.1'...Resin sealing body, 2,2'...
・External lead, 3...Semiconductor element, 4
...Printed board, 5...Solder.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を封止する封止体から複数のリード端子が導
出された半導体装置において、各リードはほぼ同じ平面
上にそれぞれ配置された部分を有し、さらに各リードは
前記部分の一方側の大部分が他方側の一部がそれぞれ前
記封止体で覆われるように導出されていることを特徴と
する半導体装置。In a semiconductor device in which a plurality of lead terminals are led out from a sealing body that seals a semiconductor element, each lead has a portion disposed on approximately the same plane, and each lead has a large portion on one side of the portion. 1. A semiconductor device, wherein each part is led out so that a part of the other side is covered with the sealing body.
JP13858383U 1983-09-07 1983-09-07 semiconductor equipment Pending JPS6045447U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13858383U JPS6045447U (en) 1983-09-07 1983-09-07 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13858383U JPS6045447U (en) 1983-09-07 1983-09-07 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS6045447U true JPS6045447U (en) 1985-03-30

Family

ID=30310901

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13858383U Pending JPS6045447U (en) 1983-09-07 1983-09-07 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS6045447U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317644U (en) * 1989-06-30 1991-02-21

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0317644U (en) * 1989-06-30 1991-02-21

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