JPS6068652U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS6068652U JPS6068652U JP16021283U JP16021283U JPS6068652U JP S6068652 U JPS6068652 U JP S6068652U JP 16021283 U JP16021283 U JP 16021283U JP 16021283 U JP16021283 U JP 16021283U JP S6068652 U JPS6068652 U JP S6068652U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor equipment
- semiconductor
- resin
- semiconductor device
- recorded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の半導体装置のペレット搭載部の部分断面
図を示す。第２図及び第３図はそれぞれ本考案の実施例
によるペレット搭載部の部分断面図を示す。
１・・・・・・半導体ペレット、２・・・・・・印刷配
線基板、３・・・・・・ボンディングワイヤー、４・・
・・・・基板上の印刷配線、ｉ・・・・・・マウント用
樹脂、６・・・・・・封止衝止、７・・・・・・樹脂枠
接着剤、８・・・・・・樹脂枠、９・・・・・・ポリシ
ロキサン誘導体の塗布部、１０・・・・・・ペレット収
納用孔部。FIG. 1 shows a partial cross-sectional view of a pellet mounting portion of a conventional semiconductor device. FIGS. 2 and 3 each show a partial cross-sectional view of a pellet loading section according to an embodiment of the present invention. 1... Semiconductor pellet, 2... Printed wiring board, 3... Bonding wire, 4...
...Printed wiring on the board, i...Mounting resin, 6...Sealing pad, 7...Resin frame adhesive, 8... . . . Resin frame, 9 . . . Polysiloxane derivative coating portion, 10 .
Claims (1)
導体で囲まれ、樹脂で封止されていることを特徴とする
半導体装置。A semiconductor device characterized in that a semiconductor pellet mounted on a substrate is surrounded by a polysiloxane derivative and sealed with a resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16021283U JPS6068652U (en) | 1983-10-17 | 1983-10-17 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16021283U JPS6068652U (en) | 1983-10-17 | 1983-10-17 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6068652U true JPS6068652U (en) | 1985-05-15 |
Family
ID=30352448
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16021283U Pending JPS6068652U (en) | 1983-10-17 | 1983-10-17 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6068652U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287127A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Works Ltd | Manufacture of chip carrier for electron element |
-
1983
- 1983-10-17 JP JP16021283U patent/JPS6068652U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61287127A (en) * | 1985-06-13 | 1986-12-17 | Matsushita Electric Works Ltd | Manufacture of chip carrier for electron element |
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