JPS59117162U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS59117162U JPS59117162U JP1137283U JP1137283U JPS59117162U JP S59117162 U JPS59117162 U JP S59117162U JP 1137283 U JP1137283 U JP 1137283U JP 1137283 U JP1137283 U JP 1137283U JP S59117162 U JPS59117162 U JP S59117162U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- recorded
- uneven
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の樹脂封止半導体装置の断面図、第２図乃
至第４図は本考案の実施例を示す樹脂封止半導体装置の
断面図である。１・・・チップ、２・・・マウント材、
３・・・基板、４・・・封止樹脂、５・・・リード、６
・・・ボンディング線。FIG. 1 is a cross-sectional view of a conventional resin-sealed semiconductor device, and FIGS. 2 to 4 are cross-sectional views of resin-sealed semiconductor devices showing embodiments of the present invention. 1... Chip, 2... Mounting material,
3... Board, 4... Sealing resin, 5... Lead, 6
...bonding wire.
Claims (1)
れていることを特徴とする樹脂封止型半導体装置。A resin-sealed semiconductor device characterized in that almost the entire surface opposite to the surface on which a semiconductor element is mounted is uneven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1137283U JPS59117162U (en) | 1983-01-28 | 1983-01-28 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1137283U JPS59117162U (en) | 1983-01-28 | 1983-01-28 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS59117162U true JPS59117162U (en) | 1984-08-07 |
Family
ID=30142800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1137283U Pending JPS59117162U (en) | 1983-01-28 | 1983-01-28 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59117162U (en) |
-
1983
- 1983-01-28 JP JP1137283U patent/JPS59117162U/en active Pending
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