JPS6073243U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS6073243U JPS6073243U JP16623383U JP16623383U JPS6073243U JP S6073243 U JPS6073243 U JP S6073243U JP 16623383 U JP16623383 U JP 16623383U JP 16623383 U JP16623383 U JP 16623383U JP S6073243 U JPS6073243 U JP S6073243U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- encapsulated semiconductor
- sealed
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ＡとＢは従来の樹脂封止形半導体装置の構造をそ
れぞれ示す断面図と側面図、第２図ＡとＢは本考案の一
実施例の樹脂封止形半導体装置の構造をそれぞれ示す断
面図と側面図であ不。
１．１１・・・・・・チップ、２，１２・・・・・・ベ
ース板、３．１３・・・・・・リード端子、４．１４・
・・・・・ボンディングワイヤ、５．１５・・・・・・
パッシベーション膜、６．１６・・・・・・樹脂モード
ル、１７・・・・・・コーテイング膜。Figures 1A and B are cross-sectional views and side views showing the structure of a conventional resin-encapsulated semiconductor device, respectively, and Figures 2A and B are respectively the structure of a resin-encapsulated semiconductor device according to an embodiment of the present invention. Shown in cross section and side view. 1.11... Chip, 2,12... Base plate, 3.13... Lead terminal, 4.14.
・・・・・・Bonding wire, 5.15・・・・・・
Passivation film, 6.16...Resin mold, 17...Coating film.
Claims (1)
止形半導体装置において、該合成樹脂の表面にフッ素系
樹脂の被膜が施されていることを特徴とする樹脂封止形
半導体装置。1. A resin-sealed semiconductor device in which a semiconductor chip is sealed with a synthetic resin, characterized in that a fluororesin coating is applied to the surface of the synthetic resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16623383U JPS6073243U (en) | 1983-10-27 | 1983-10-27 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16623383U JPS6073243U (en) | 1983-10-27 | 1983-10-27 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6073243U true JPS6073243U (en) | 1985-05-23 |
Family
ID=30363980
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16623383U Pending JPS6073243U (en) | 1983-10-27 | 1983-10-27 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6073243U (en) |
-
1983
- 1983-10-27 JP JP16623383U patent/JPS6073243U/en active Pending
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