JPS5834741U - Resin-encapsulated semiconductor device - Google Patents
Resin-encapsulated semiconductor deviceInfo
- Publication number
- JPS5834741U JPS5834741U JP13135281U JP13135281U JPS5834741U JP S5834741 U JPS5834741 U JP S5834741U JP 13135281 U JP13135281 U JP 13135281U JP 13135281 U JP13135281 U JP 13135281U JP S5834741 U JPS5834741 U JP S5834741U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead plate
- encapsulated semiconductor
- moisture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図Ａは従来の樹脂封止型半導体装置の平面図、第１
図Ｂは同じく側面図、第２図Ａはこの考案の第１の実施
例の樹脂封止型半導体装置の要部斜視図、第２図Ｂは同
じく要部平面図、第２図Ｃは同じく側面図、第３図Ａは
この考案の第２の実施例の樹脂封止型半導体装置の要部
斜視図、第３図Ｂは同じく要部平面図、第３図Ｃは同じ
く側面図、第４図Ａはこの考案の第３の実施例の樹脂封
止型半導体装置の要部斜視図、第４図Ｂは同じく要部平
面図、第４図Ｃは同じく側面図である。Figure 1A is a plan view of a conventional resin-sealed semiconductor device;
Figure B is a side view, Figure 2A is a perspective view of the main parts of the resin-sealed semiconductor device according to the first embodiment of the invention, Figure 2B is a plan view of the main parts, and Figure 2C is the same. 3A is a perspective view of the main parts of a resin-sealed semiconductor device according to the second embodiment of the invention, FIG. 3B is a plan view of the main parts, and FIG. 3C is a side view, FIG. 4A is a perspective view of a main part of a resin-sealed semiconductor device according to a third embodiment of the invention, FIG. 4B is a plan view of the main part, and FIG. 4C is a side view of the same.
Claims (1)
プと、前記リード板の端縁部に脚部を固定して前記半導
体チップの上方を覆う防湿カバーと、少くとも前記リー
ド板と前記防湿カバーとの間に充填した封止樹脂とを備
えた樹脂封止型半導体装置。A lead plate, a semiconductor chip mounted in the center of the lead plate, a moisture-proof cover having legs fixed to an edge of the lead plate and covering above the semiconductor chip, and at least the lead plate and the moisture-proof cover. A resin-sealed semiconductor device comprising: and a sealing resin filled between.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13135281U JPS5834741U (en) | 1981-08-31 | 1981-08-31 | Resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13135281U JPS5834741U (en) | 1981-08-31 | 1981-08-31 | Resin-encapsulated semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5834741U true JPS5834741U (en) | 1983-03-07 |
Family
ID=29924936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13135281U Pending JPS5834741U (en) | 1981-08-31 | 1981-08-31 | Resin-encapsulated semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5834741U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0367418U (en) * | 1989-11-02 | 1991-07-01 |
-
1981
- 1981-08-31 JP JP13135281U patent/JPS5834741U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0367418U (en) * | 1989-11-02 | 1991-07-01 |
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