JPS59115655U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59115655U
JPS59115655U JP807383U JP807383U JPS59115655U JP S59115655 U JPS59115655 U JP S59115655U JP 807383 U JP807383 U JP 807383U JP 807383 U JP807383 U JP 807383U JP S59115655 U JPS59115655 U JP S59115655U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
hole
plate
package
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP807383U
Other languages
Japanese (ja)
Inventor
植松 伸夫
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP807383U priority Critical patent/JPS59115655U/en
Publication of JPS59115655U publication Critical patent/JPS59115655U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は従来のフラットパッケージの断面図、第2図は
従来のフラットパッケージをプリント板実装する様子を
示す断面図、第3図は本考案のフラットパッケージの実
施例を示す断面図、第4図は本考案のフラットパッケー
ジをプリント板実装する様子を示す断面図、第5図は第
4図の穴の周辺の拡大図である。 1・・・樹脂封止部、2・・・リード端子、3・・・プ
リント板の配線部、4・・・プリント板の支持板、5・
・・板、6・・・固定用治具。
FIG. 1 is a sectional view of a conventional flat package, FIG. 2 is a sectional view showing how the conventional flat package is mounted on a printed board, FIG. 3 is a sectional view showing an embodiment of the flat package of the present invention, and FIG. The figure is a sectional view showing how the flat package of the present invention is mounted on a printed board, and FIG. 5 is an enlarged view of the vicinity of the hole in FIG. 4. DESCRIPTION OF SYMBOLS 1... Resin sealing part, 2... Lead terminal, 3... Wiring part of printed board, 4... Support plate of printed board, 5...
...Plate, 6...Fixing jig.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] パッケージの裏面に設けられた穴と同位置に該穴より小
さい穴を有する板をはりつけたことを特徴とする半導体
装置。
A semiconductor device characterized in that a plate having a hole smaller than the hole provided on the back side of the package is attached at the same position as the hole.
JP807383U 1983-01-24 1983-01-24 semiconductor equipment Pending JPS59115655U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP807383U JPS59115655U (en) 1983-01-24 1983-01-24 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP807383U JPS59115655U (en) 1983-01-24 1983-01-24 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59115655U true JPS59115655U (en) 1984-08-04

Family

ID=30139580

Family Applications (1)

Application Number Title Priority Date Filing Date
JP807383U Pending JPS59115655U (en) 1983-01-24 1983-01-24 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59115655U (en)

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