JPS5978661U - Hybrid microelement circuit - Google Patents

Hybrid microelement circuit

Info

Publication number
JPS5978661U
JPS5978661U JP17351482U JP17351482U JPS5978661U JP S5978661 U JPS5978661 U JP S5978661U JP 17351482 U JP17351482 U JP 17351482U JP 17351482 U JP17351482 U JP 17351482U JP S5978661 U JPS5978661 U JP S5978661U
Authority
JP
Japan
Prior art keywords
microelement
hybrid
circuit
substrate
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17351482U
Other languages
Japanese (ja)
Inventor
津村 春英
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP17351482U priority Critical patent/JPS5978661U/en
Publication of JPS5978661U publication Critical patent/JPS5978661U/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本考案の一実施例を示すチップ実装基板の側面
図、第2図はその分解斜視図である。 1.2・・・基板、3・・・配線用プリント板、4,5
・・・チップ、6・・・リード端子、7・・・スルーホ
ール穴。
FIG. 1 is a side view of a chip mounting board showing an embodiment of the present invention, and FIG. 2 is an exploded perspective view thereof. 1.2... Board, 3... Printed board for wiring, 4, 5
...Chip, 6...Lead terminal, 7...Through hole.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 基板^両側にチップ部品を実装するとともに、その回路
配線手段を基板中に埋設したことを特徴とする混成微小
素子回路。−
A hybrid microelement circuit characterized by mounting chip components on both sides of a substrate and embedding circuit wiring means in the substrate. −
JP17351482U 1982-11-18 1982-11-18 Hybrid microelement circuit Pending JPS5978661U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17351482U JPS5978661U (en) 1982-11-18 1982-11-18 Hybrid microelement circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17351482U JPS5978661U (en) 1982-11-18 1982-11-18 Hybrid microelement circuit

Publications (1)

Publication Number Publication Date
JPS5978661U true JPS5978661U (en) 1984-05-28

Family

ID=30377974

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17351482U Pending JPS5978661U (en) 1982-11-18 1982-11-18 Hybrid microelement circuit

Country Status (1)

Country Link
JP (1) JPS5978661U (en)

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