JPS6016550U - Mounting structure of electronic components on heat sink - Google Patents
Mounting structure of electronic components on heat sinkInfo
- Publication number
- JPS6016550U JPS6016550U JP10690183U JP10690183U JPS6016550U JP S6016550 U JPS6016550 U JP S6016550U JP 10690183 U JP10690183 U JP 10690183U JP 10690183 U JP10690183 U JP 10690183U JP S6016550 U JPS6016550 U JP S6016550U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic components
- mounting structure
- electronic component
- tongue piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図乃至第2図は本考案の一実施例を示す斜視図、第
3図乃至第4図は放熱板の変形例を示す斜視図、第5図
は舌片の変形例を示す平面図である。
図中、1はプリント基板、2は放熱板、3は電子部品、
4は舌片、5は切欠部である。Figures 1 and 2 are perspective views showing an embodiment of the present invention, Figures 3 and 4 are perspective views showing a modification of the heat sink, and Figure 5 is a plan view showing a modification of the tongue piece. It is. In the figure, 1 is a printed circuit board, 2 is a heat sink, 3 is an electronic component,
4 is a tongue piece, and 5 is a notch.
Claims (1)
放熱板と該舌片との間に形成される切欠部に電子部品を
圧入すると共に、該舌片を該電子部品に当接させて該電
子部品を前記放熱板に密着固定することを特徴とする電
子部品の放熱板への取付は構造。An L-shaped tongue piece is provided on the heat sink plate at almost right angles to the heat sink plate, an electronic component is press-fitted into the notch formed between the heat sink plate and the tongue piece, and the tongue piece is inserted into the electronic component. A structure for attaching an electronic component to a heat sink, characterized in that the electronic component is closely fixed to the heat sink by making contact with the heat sink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10690183U JPS6016550U (en) | 1983-07-08 | 1983-07-08 | Mounting structure of electronic components on heat sink |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10690183U JPS6016550U (en) | 1983-07-08 | 1983-07-08 | Mounting structure of electronic components on heat sink |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6016550U true JPS6016550U (en) | 1985-02-04 |
JPS6336693Y2 JPS6336693Y2 (en) | 1988-09-28 |
Family
ID=30249980
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10690183U Granted JPS6016550U (en) | 1983-07-08 | 1983-07-08 | Mounting structure of electronic components on heat sink |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6016550U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55175254U (en) * | 1979-05-31 | 1980-12-16 | ||
JPS58116238U (en) * | 1982-02-02 | 1983-08-08 | 株式会社ユ−シン | Transistor heat sink device |
-
1983
- 1983-07-08 JP JP10690183U patent/JPS6016550U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55175254U (en) * | 1979-05-31 | 1980-12-16 | ||
JPS58116238U (en) * | 1982-02-02 | 1983-08-08 | 株式会社ユ−シン | Transistor heat sink device |
Also Published As
Publication number | Publication date |
---|---|
JPS6336693Y2 (en) | 1988-09-28 |
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