JPS58116238U - Transistor heat sink device - Google Patents

Transistor heat sink device

Info

Publication number
JPS58116238U
JPS58116238U JP1982012545U JP1254582U JPS58116238U JP S58116238 U JPS58116238 U JP S58116238U JP 1982012545 U JP1982012545 U JP 1982012545U JP 1254582 U JP1254582 U JP 1254582U JP S58116238 U JPS58116238 U JP S58116238U
Authority
JP
Japan
Prior art keywords
heat sink
sink device
semiconductor
transistor heat
cut
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982012545U
Other languages
Japanese (ja)
Other versions
JPS6234449Y2 (en
Inventor
啓介 福島
雅和 熊野
Original Assignee
株式会社ユ−シン
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社ユ−シン filed Critical 株式会社ユ−シン
Priority to JP1982012545U priority Critical patent/JPS58116238U/en
Publication of JPS58116238U publication Critical patent/JPS58116238U/en
Application granted granted Critical
Publication of JPS6234449Y2 publication Critical patent/JPS6234449Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来実施例の平面図、第２図は第１図の側面図
、第３図は本考案の第１の実施例を示す平面図、第４図
は第３図の側面図、第５図は本考案の第２の実施例を示
す平面図、゛第６図は第５図の側面図、第７図は本考案
の第３の実施例を示す平面図、第８図は第７図の側面図
、第９図は本考案の第４の実施例を示す平面図、第１０
図は第９図の側面図、第１゛１図は第７図のＡ−Ａ断面
図、第１２図は第９図のＢ−Ｂ断面図、第１３図は本考
案の第５の実施例を示す平面図、第１４図は第　　　　
−１３図の側面図、第１５図は第１３図のＣ−Ｃ断面図
、第１６図は放熱板の切起し部の拡大側面図である。 １．６・・・トランジスタ、７・・・取付孔、２．　８
゜１１．１５．１９・・・放熱板、９．　１０．　１２
゜１３．１６，１７．１Ｂ、２０．２１・・・切起し部
。Fig. 1 is a plan view of the conventional embodiment, Fig. 2 is a side view of Fig. 1, Fig. 3 is a plan view showing the first embodiment of the present invention, Fig. 4 is a side view of Fig. 3, FIG. 5 is a plan view showing the second embodiment of the present invention, FIG. 6 is a side view of FIG. 5, FIG. 7 is a plan view showing the third embodiment of the present invention, and FIG. FIG. 7 is a side view, FIG. 9 is a plan view showing the fourth embodiment of the present invention, and FIG.
The figure is a side view of FIG. 9, FIG. 1-1 is a sectional view taken along line A-A in FIG. 7, FIG. A plan view showing an example, Fig. 14 is
- Fig. 13 is a side view, Fig. 15 is a sectional view taken along the line CC in Fig. 13, and Fig. 16 is an enlarged side view of the cut-and-raised portion of the heat sink. 1.6...Transistor, 7...Mounting hole, 2. 8
゜11.15.19... Heat sink, 9. 10. 12
゜13.16, 17.1B, 20.21... cut and raised portions.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体に組付ける放熱板に切起し部を形成し、該切起し
部の少なくとも１個は該半導体の高・さより高く形成し
該乎導体の上面に折曲げる゛ことにより該半導体を固定
することを特徴とする半導体の放熱板装置。A cut-and-raised portion is formed on a heat dissipation plate to be assembled to the semiconductor, and at least one of the cut-and-raised portions is formed higher than the height of the semiconductor, and the semiconductor is fixed by bending it over the top surface of the conductor. A semiconductor heat sink device characterized by:
JP1982012545U 1982-02-02 1982-02-02 Transistor heat sink device Granted JPS58116238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982012545U JPS58116238U (en) 1982-02-02 1982-02-02 Transistor heat sink device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982012545U JPS58116238U (en) 1982-02-02 1982-02-02 Transistor heat sink device

Publications (2)

Publication Number Publication Date
JPS58116238U true JPS58116238U (en) 1983-08-08
JPS6234449Y2 JPS6234449Y2 (en) 1987-09-02

Family

ID=30025110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982012545U Granted JPS58116238U (en) 1982-02-02 1982-02-02 Transistor heat sink device

Country Status (1)

Country Link
JP (1) JPS58116238U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016550U (en) * 1983-07-08 1985-02-04 富士通テン株式会社 Mounting structure of electronic components on heat sink

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037042U (en) * 1973-07-31 1975-04-18
JPS5729154U (en) * 1980-07-25 1982-02-16

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037042B2 (en) * 1973-05-28 1975-11-29
GB1492937A (en) * 1973-12-28 1977-11-23 Beecham Group Ltd Enzyme complexes and their use

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5037042U (en) * 1973-07-31 1975-04-18
JPS5729154U (en) * 1980-07-25 1982-02-16

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6016550U (en) * 1983-07-08 1985-02-04 富士通テン株式会社 Mounting structure of electronic components on heat sink

Also Published As

Publication number Publication date
JPS6234449Y2 (en) 1987-09-02

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