JPS59164238U - Hybrid integrated circuit device - Google Patents

Hybrid integrated circuit device

Info

Publication number
JPS59164238U
JPS59164238U JP5884483U JP5884483U JPS59164238U JP S59164238 U JPS59164238 U JP S59164238U JP 5884483 U JP5884483 U JP 5884483U JP 5884483 U JP5884483 U JP 5884483U JP S59164238 U JPS59164238 U JP S59164238U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
ceramic substrate
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5884483U
Other languages
Japanese (ja)
Inventor
山田 辰彦
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP5884483U priority Critical patent/JPS59164238U/en
Publication of JPS59164238U publication Critical patent/JPS59164238U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図aおよびbは本考案の一実施例の斜視図および平
面図、第2図は第1図すのA−A’断面図である。図に
おいて、 1・・・・・・金属板、2・・・・・・突起、3・・・
;・・セラミック基板である。
1A and 1B are a perspective view and a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along the line AA' in FIG. 1. In the figure, 1...Metal plate, 2...Protrusion, 3...
;...It is a ceramic substrate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 表面に回路配線等が設けられているセラミック基板の裏
面と金属板とが固着されてなる混成集積回路装置におい
て、前記金属板に前記セラミック基板の周縁に接する突
起を前記セラミック基板の各辺に対応する位置に少くと
も1個づつ設けたことを特徴とする混成集積回路装置。
In a hybrid integrated circuit device in which a metal plate is fixed to the back side of a ceramic substrate on which circuit wiring etc. are provided, the metal plate has protrusions that contact the periphery of the ceramic substrate, corresponding to each side of the ceramic substrate. A hybrid integrated circuit device characterized in that at least one hybrid integrated circuit device is provided at each position.
JP5884483U 1983-04-20 1983-04-20 Hybrid integrated circuit device Pending JPS59164238U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5884483U JPS59164238U (en) 1983-04-20 1983-04-20 Hybrid integrated circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5884483U JPS59164238U (en) 1983-04-20 1983-04-20 Hybrid integrated circuit device

Publications (1)

Publication Number Publication Date
JPS59164238U true JPS59164238U (en) 1984-11-02

Family

ID=30189109

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5884483U Pending JPS59164238U (en) 1983-04-20 1983-04-20 Hybrid integrated circuit device

Country Status (1)

Country Link
JP (1) JPS59164238U (en)

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