JPS5983069U - Hybrid integrated circuit device - Google Patents
Hybrid integrated circuit deviceInfo
- Publication number
- JPS5983069U JPS5983069U JP17808682U JP17808682U JPS5983069U JP S5983069 U JPS5983069 U JP S5983069U JP 17808682 U JP17808682 U JP 17808682U JP 17808682 U JP17808682 U JP 17808682U JP S5983069 U JPS5983069 U JP S5983069U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid integrated
- metal plate
- ceramic substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ及びｂは本考案の一実施例の斜視図および平面
図、第２図は第１図すのＡ、−Ａ’断面図である。
図において、１・・・・・・金属板、２・・・・・・突
起、３・・・・・・セラミック基板、４・・・・・・穴
である。1A and 1B are a perspective view and a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view taken along line A and -A' in FIG. In the figure, 1...metal plate, 2...protrusion, 3...ceramic substrate, 4...hole.
Claims (1)
面と金属板とが固着されてなる混成集積回路装置におい
て、前記セラミック基板には少くとも２個以上の穴が設
けられ、これら穴それぞれにはまり込む突起を前記金属
板に設けた事を特徴とする混成集積回路装置。In a hybrid integrated circuit device in which a metal plate is fixed to the back side of a ceramic substrate on which circuit wiring etc. are provided, at least two or more holes are provided in the ceramic substrate, and a metal plate is fitted into each of the holes. A hybrid integrated circuit device characterized in that the metal plate is provided with a projection into which the metal plate is inserted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17808682U JPS5983069U (en) | 1982-11-25 | 1982-11-25 | Hybrid integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17808682U JPS5983069U (en) | 1982-11-25 | 1982-11-25 | Hybrid integrated circuit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5983069U true JPS5983069U (en) | 1984-06-05 |
Family
ID=30386737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17808682U Pending JPS5983069U (en) | 1982-11-25 | 1982-11-25 | Hybrid integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5983069U (en) |
-
1982
- 1982-11-25 JP JP17808682U patent/JPS5983069U/en active Pending
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