JPS587396U - Circuit board for heat generating parts - Google Patents

Circuit board for heat generating parts

Info

Publication number
JPS587396U
JPS587396U JP1981100561U JP10056181U JPS587396U JP S587396 U JPS587396 U JP S587396U JP 1981100561 U JP1981100561 U JP 1981100561U JP 10056181 U JP10056181 U JP 10056181U JP S587396 U JPS587396 U JP S587396U
Authority
JP
Japan
Prior art keywords
circuit board
heat generating
generating parts
heat transfer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1981100561U
Other languages
Japanese (ja)
Inventor
三戸　修悦
鈴木　久司
Original Assignee
株式会社東芝
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社東芝 filed Critical 株式会社東芝
Priority to JP1981100561U priority Critical patent/JPS587396U/en
Publication of JPS587396U publication Critical patent/JPS587396U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来の回路基板を示す斜視ｌ第２図は回路基板
を基板取付装置に取付けた状態を示す斜視図。第３図乃
至第５図本考案の実施例を示すもので、第３図は回路基
板と基板取付装置の要部を示す斜視図。第４図は第３図
のＡ−Ａ′線断面□図。第５図は基板取付装置に取付け
られた回路基板の状態を示す一平面図。第６図は本考案
の他の実、流側を示すもので、第４図に相当する断面図
である。 図面中、１１．２１・・・回路基板、１２．２２・・・
配線基板、１３．２３・・・部品、１４．２４・・・伝
熱板、１５．２５・・・伝熱スペーサ。FIG. 1 is a perspective view showing a conventional circuit board. FIG. 2 is a perspective view showing the circuit board mounted on a board mounting device. FIGS. 3 to 5 show an embodiment of the present invention, and FIG. 3 is a perspective view showing the main parts of a circuit board and a board mounting device. FIG. 4 is a cross-sectional view taken along line A-A' in FIG. FIG. 5 is a plan view showing the state of the circuit board mounted on the board mounting device. FIG. 6 shows another embodiment of the present invention, the flow side, and is a sectional view corresponding to FIG. 4. In the drawings, 11.21... circuit board, 12.22...
Wiring board, 13.23... Parts, 14.24... Heat transfer plate, 15.25... Heat transfer spacer.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 部品が配線される配線基板と、この配線基板に固定され
た伝熱板とを備えた発熱部品用回路基板において、前記
伝熱板には、補助伝熱経路を構成する伝熱スペーサが設
けられていることを特徴とする発熱部品用回路基板。In a circuit board for heat-generating components that includes a wiring board on which components are wired and a heat transfer plate fixed to the wiring board, the heat transfer plate is provided with a heat transfer spacer that constitutes an auxiliary heat transfer path. A circuit board for heat-generating components.
JP1981100561U 1981-07-08 1981-07-08 Circuit board for heat generating parts Pending JPS587396U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1981100561U JPS587396U (en) 1981-07-08 1981-07-08 Circuit board for heat generating parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1981100561U JPS587396U (en) 1981-07-08 1981-07-08 Circuit board for heat generating parts

Publications (1)

Publication Number Publication Date
JPS587396U true JPS587396U (en) 1983-01-18

Family

ID=29895245

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1981100561U Pending JPS587396U (en) 1981-07-08 1981-07-08 Circuit board for heat generating parts

Country Status (1)

Country Link
JP (1) JPS587396U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138958A (en) * 2009-12-28 2011-07-14 Toshiba Corp Electronic apparatus
CN102954445A (en) * 2012-11-28 2013-03-06 深圳市通用科技有限公司 Aluminum substrate fixing structure applied to LED (Light-emitting Diode) lamp

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011138958A (en) * 2009-12-28 2011-07-14 Toshiba Corp Electronic apparatus
CN102954445A (en) * 2012-11-28 2013-03-06 深圳市通用科技有限公司 Aluminum substrate fixing structure applied to LED (Light-emitting Diode) lamp

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