JPS5892794U - Cooling device for electronic components mounted on printed wiring boards - Google Patents
Cooling device for electronic components mounted on printed wiring boardsInfo
- Publication number
- JPS5892794U JPS5892794U JP18724681U JP18724681U JPS5892794U JP S5892794 U JPS5892794 U JP S5892794U JP 18724681 U JP18724681 U JP 18724681U JP 18724681 U JP18724681 U JP 18724681U JP S5892794 U JPS5892794 U JP S5892794U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- cooling device
- electronic components
- components mounted
- wiring boards
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案による印刷配線板実装部品の冷却具の斜
視図、第2図は第1図の本考案実施例を電子機器装置に
実装した状態を説明するための部分斜視図、第3図は本
考案による他の冷却具の斜視図である。
1.1a・・・・・・冷却具、3,3a・・・・・・固
定部、8゜8a・・・・・・素子圧接部、10,10a
・・・・・・接触部、12・・・・・・シェルフ枠体、
17・・・・・・印刷配線板、19・・・・・・電子部
品、20・・・・・・筐体カバー。FIG. 1 is a perspective view of a cooling device for printed wiring board mounted components according to the present invention, FIG. 2 is a partial perspective view for explaining the state in which the embodiment of the present invention shown in FIG. 1 is mounted on an electronic device, and FIG. The figure is a perspective view of another cooling device according to the present invention. 1.1a...Cooling tool, 3,3a...Fixing part, 8°8a...Element pressure contact part, 10,10a
...Contact part, 12...Shelf frame,
17... Printed wiring board, 19... Electronic components, 20... Housing cover.
Claims (1)
装した発熱性の電子部品の冷却において、印刷配線板に
固着するための固定部と、弾性を有′ し発熱性の電
子部品に圧接させる素子圧接部と、弾性を有しシェルフ
枠体に圧接させる接触部とを有することを特徴とする印
刷配線板実装部品の冷却具。In cooling heat-generating electronic components mounted on a printed wiring board mounted on a shelf frame of an electronic device, a fixing part for fixing to the printed wiring board and an elastic part that is pressed into contact with the heat-generating electronic component are provided. 1. A cooling device for printed wiring board mounted components, comprising an element pressure contact portion and a contact portion having elasticity and pressure contact with a shelf frame.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18724681U JPS5892794U (en) | 1981-12-15 | 1981-12-15 | Cooling device for electronic components mounted on printed wiring boards |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18724681U JPS5892794U (en) | 1981-12-15 | 1981-12-15 | Cooling device for electronic components mounted on printed wiring boards |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5892794U true JPS5892794U (en) | 1983-06-23 |
Family
ID=29989885
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18724681U Pending JPS5892794U (en) | 1981-12-15 | 1981-12-15 | Cooling device for electronic components mounted on printed wiring boards |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5892794U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014078552A (en) * | 2012-10-09 | 2014-05-01 | Hitachi Metals Ltd | Communication module and communication device |
-
1981
- 1981-12-15 JP JP18724681U patent/JPS5892794U/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014078552A (en) * | 2012-10-09 | 2014-05-01 | Hitachi Metals Ltd | Communication module and communication device |
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