JPS58153453U - heat sink - Google Patents
heat sinkInfo
- Publication number
- JPS58153453U JPS58153453U JP5074982U JP5074982U JPS58153453U JP S58153453 U JPS58153453 U JP S58153453U JP 5074982 U JP5074982 U JP 5074982U JP 5074982 U JP5074982 U JP 5074982U JP S58153453 U JPS58153453 U JP S58153453U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- circuit board
- printed circuit
- component mounted
- abstract
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ、 ｂはプリント基板に従来のヒートシンク
を装着した一例を示す平面図と側面図、第２図ａ、
ｂはこの考案の一実施例を示す平面図と側面図である。
図中、１はプリント基板、２は第１のトランジスタ、３
は第２のトランジスタ、４はレジスタ、６はコネクタ、
７はヒートシンクである。なお、図中の同一符号は同一
または相当部分を示す。Figures 1a and 1b are plan and side views showing an example of a conventional heat sink attached to a printed circuit board, and Figures 2a and 2b are
b is a plan view and a side view showing an embodiment of this invention. In the figure, 1 is a printed circuit board, 2 is a first transistor, 3
is the second transistor, 4 is the resistor, 6 is the connector,
7 is a heat sink. Note that the same reference numerals in the figures indicate the same or corresponding parts.
Claims (1)
品の吸熱放熱用のヒートシンクにおいて、前記ヒートシ
ンクを前記プリント基板に装着された回路構成部品上を
おおって形成配置したことを特徴とするヒートシンク。1. A heat sink for absorbing and dissipating heat from a circuit component mounted on a printed circuit board of an electronic control device, characterized in that the heat sink is formed and arranged to cover the circuit component mounted on the printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5074982U JPS58153453U (en) | 1982-04-06 | 1982-04-06 | heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5074982U JPS58153453U (en) | 1982-04-06 | 1982-04-06 | heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58153453U true JPS58153453U (en) | 1983-10-14 |
Family
ID=30061530
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5074982U Pending JPS58153453U (en) | 1982-04-06 | 1982-04-06 | heat sink |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58153453U (en) |
-
1982
- 1982-04-06 JP JP5074982U patent/JPS58153453U/en active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS58153453U (en) | heat sink | |
| JPS5923771U (en) | electronic equipment | |
| JPS587396U (en) | Circuit board for heat generating parts | |
| JPS6127247U (en) | Heat dissipation device for semiconductor devices | |
| JPS5858327U (en) | chip parts | |
| JPS5965563U (en) | printed wiring board | |
| JPS60118249U (en) | Semiconductor mounting equipment | |
| JPS58175668U (en) | printed wiring board | |
| JPS5999477U (en) | Hybrid integrated circuit device | |
| JPS58111992U (en) | Shield structure of solid electronic components | |
| JPS59127270U (en) | printed circuit board equipment | |
| JPS58155898U (en) | Shield device | |
| JPS5874346U (en) | integrated circuit module | |
| JPS6039295U (en) | printed wiring board | |
| JPS60170988U (en) | IC socket device | |
| JPS5929095U (en) | electronic equipment | |
| JPS6078165U (en) | printed circuit board equipment | |
| JPS5983071U (en) | printed wiring board | |
| JPS5837168U (en) | Electrical component mounting unit | |
| JPS606237U (en) | printed wiring board | |
| JPS5918495U (en) | circuit board equipment | |
| JPS6081674U (en) | Ceramic hybrid integrated circuit device | |
| JPS5812953U (en) | semiconductor equipment | |
| JPS6140027U (en) | module filter | |
| JPS5978661U (en) | Hybrid microelement circuit |