JPS58114047U - Semiconductor device mounting structure - Google Patents

Semiconductor device mounting structure

Info

Publication number
JPS58114047U
JPS58114047U JP1036582U JP1036582U JPS58114047U JP S58114047 U JPS58114047 U JP S58114047U JP 1036582 U JP1036582 U JP 1036582U JP 1036582 U JP1036582 U JP 1036582U JP S58114047 U JPS58114047 U JP S58114047U
Authority
JP
Japan
Prior art keywords
semiconductor device
mounting structure
heat dissipation
device mounting
wiring board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1036582U
Other languages
Japanese (ja)
Other versions
JPH0227566Y2 (en
Inventor
尚 佐藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1036582U priority Critical patent/JPS58114047U/en
Publication of JPS58114047U publication Critical patent/JPS58114047U/en
Application granted granted Critical
Publication of JPH0227566Y2 publication Critical patent/JPH0227566Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体装置の実装構造を説明するための
斜視図、第２図は本考案による半導体装置の実装構造を
示す一例の斜視図である。゛図面において、１はプリン
ト板、２と１０は放熱フィン、３は半導体装置、１２は
切り起しをそれぞれ示す。FIG. 1 is a perspective view for explaining a conventional semiconductor device mounting structure, and FIG. 2 is a perspective view of an example of a semiconductor device mounting structure according to the present invention. In the drawings, 1 is a printed board, 2 and 10 are radiation fins, 3 is a semiconductor device, and 12 is a cutout.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱フィンを具備せしめる半導体装着を印刷配線板に取
着する半導体装置の実装構造において、該放熱フィンに
前記半導体装置の取付は位置を規制する部材を設は該半
導体装置を該熟熱フィンに螺着するとともに、該放熱フ
ィンと前記印刷配線板との間に空隙を設けて取着するよ
うにしたこと、　を特徴とする半導体装置の実装構造。In a semiconductor device mounting structure in which a semiconductor mounting provided with heat dissipation fins is attached to a printed wiring board, a member for regulating the mounting position of the semiconductor device is provided on the heat dissipation fin, and the semiconductor device is screwed onto the heat dissipation fin. A mounting structure for a semiconductor device, characterized in that the heat dissipation fin and the printed wiring board are mounted with a gap provided between the heat radiation fin and the printed wiring board.
JP1036582U 1982-01-27 1982-01-27 Semiconductor device mounting structure Granted JPS58114047U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1036582U JPS58114047U (en) 1982-01-27 1982-01-27 Semiconductor device mounting structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1036582U JPS58114047U (en) 1982-01-27 1982-01-27 Semiconductor device mounting structure

Publications (2)

Publication Number Publication Date
JPS58114047U true JPS58114047U (en) 1983-08-04
JPH0227566Y2 JPH0227566Y2 (en) 1990-07-25

Family

ID=30023018

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1036582U Granted JPS58114047U (en) 1982-01-27 1982-01-27 Semiconductor device mounting structure

Country Status (1)

Country Link
JP (1) JPS58114047U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241795A (en) * 1990-02-19 1991-10-28 Nec Corp Power amplification module structure

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397967U (en) * 1977-01-12 1978-08-09

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5397967U (en) * 1977-01-12 1978-08-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH03241795A (en) * 1990-02-19 1991-10-28 Nec Corp Power amplification module structure

Also Published As

Publication number Publication date
JPH0227566Y2 (en) 1990-07-25

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