JPS5989598U - heat dissipation device - Google Patents

heat dissipation device

Info

Publication number
JPS5989598U
JPS5989598U JP18587682U JP18587682U JPS5989598U JP S5989598 U JPS5989598 U JP S5989598U JP 18587682 U JP18587682 U JP 18587682U JP 18587682 U JP18587682 U JP 18587682U JP S5989598 U JPS5989598 U JP S5989598U
Authority
JP
Japan
Prior art keywords
heat dissipation
dissipation device
circuit board
printed circuit
metal plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18587682U
Other languages
Japanese (ja)
Inventor
勝山　正喜
Original Assignee
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電器産業株式会社 filed Critical 松下電器産業株式会社
Priority to JP18587682U priority Critical patent/JPS5989598U/en
Publication of JPS5989598U publication Critical patent/JPS5989598U/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例における放熱装置の斜視図、第２図ａ、
　　ｂは同側面図、第３図は本考案の一実施例における
放熱装置の斜視図、第４図ａ、　　ｂは同側面図である
。 １・・・・・・プリント基板、２ｂ・・・・・・放熱板
の側面、５・・・・・・隙間。Figure 1 is a perspective view of a conventional heat dissipation device, Figure 2a,
FIG. 3 is a perspective view of a heat dissipation device according to an embodiment of the present invention, and FIGS. 4A and 4B are side views of the same. 1...Printed circuit board, 2b...Side surface of heat sink, 5...Gap.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属性板体をＬ字状に折曲げて形成した放熱板の下部の
一辺をプリント基板に取付タナ、上記金属性板体の他辺
の下端を切除して振動や衝撃による上記放熱板や上記プ
リント基板のたわみによるふれ布より大きな隙間を設け
た放熱装置。One side of the lower part of the heat sink formed by bending a metal plate into an L-shape is attached to a printed circuit board, and the lower end of the other side of the metal plate is cut off to prevent the heat sink from being damaged by vibration or impact. A heat dissipation device with a gap larger than that of the flap due to the deflection of the printed circuit board.
JP18587682U 1982-12-07 1982-12-07 heat dissipation device Pending JPS5989598U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18587682U JPS5989598U (en) 1982-12-07 1982-12-07 heat dissipation device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18587682U JPS5989598U (en) 1982-12-07 1982-12-07 heat dissipation device

Publications (1)

Publication Number Publication Date
JPS5989598U true JPS5989598U (en) 1984-06-18

Family

ID=30401637

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18587682U Pending JPS5989598U (en) 1982-12-07 1982-12-07 heat dissipation device

Country Status (1)

Country Link
JP (1) JPS5989598U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007174588A (en) * 2005-12-26 2007-07-05 Star Micronics Co Ltd Headphone

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007174588A (en) * 2005-12-26 2007-07-05 Star Micronics Co Ltd Headphone

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