JPS58172812U - Electronics - Google Patents
ElectronicsInfo
- Publication number
- JPS58172812U JPS58172812U JP7122482U JP7122482U JPS58172812U JP S58172812 U JPS58172812 U JP S58172812U JP 7122482 U JP7122482 U JP 7122482U JP 7122482 U JP7122482 U JP 7122482U JP S58172812 U JPS58172812 U JP S58172812U
- Authority
- JP
- Japan
- Prior art keywords
- drip
- circuit board
- electronic device
- proof cover
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の実施例を適用した電子秤の一部破断乎
面図、第2図は第1図■−■線で切断した縦断拡大側面
図、第3. 4図は夫々他の実施例を示す要部縦断側面
図である。
1・・・・・・本体、6・・・・・・プリント基板、1
2.12.12“・・・・・・防滴カバー、13・・・
・・・放熱部材。FIG. 1 is a partially cutaway side view of an electronic scale to which an embodiment of the present invention is applied, FIG. FIG. 4 is a vertical sectional side view of a main part showing other embodiments. 1...Main body, 6...Printed circuit board, 1
2.12.12 "・・・Drip-proof cover, 13...
...Heat dissipation member.
Claims (3)
ント基板の上方に該基板の一部又は全体を覆う防滴カバ
ーを設置したことを特徴とする電子機器。(1) An electronic device characterized in that a drip-proof cover is installed above a printed circuit board on which various electronic components and the like are disposed within the main body to cover part or all of the circuit board.
の範囲第1項記載の電子機器。(2) The electronic device according to claim 1, in which the drip-proof cover is installed in an inclined manner.
ーをプリント基板上の放熱部材に接触させた実用新案登
録請求の範囲第1項又は第2項記載の電子機器。(3) The electronic device according to claim 1 or 2, wherein the drip-proof cover is made of a metal material and is brought into contact with a heat dissipation member on a printed circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7122482U JPS58172812U (en) | 1982-05-14 | 1982-05-14 | Electronics |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7122482U JPS58172812U (en) | 1982-05-14 | 1982-05-14 | Electronics |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS58172812U true JPS58172812U (en) | 1983-11-18 |
Family
ID=30080853
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7122482U Pending JPS58172812U (en) | 1982-05-14 | 1982-05-14 | Electronics |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS58172812U (en) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517614U (en) * | 1978-07-14 | 1980-02-04 |
-
1982
- 1982-05-14 JP JP7122482U patent/JPS58172812U/en active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5517614U (en) * | 1978-07-14 | 1980-02-04 |
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