JPS58195481U - electronic equipment - Google Patents

electronic equipment

Info

Publication number
JPS58195481U
JPS58195481U JP9317782U JP9317782U JPS58195481U JP S58195481 U JPS58195481 U JP S58195481U JP 9317782 U JP9317782 U JP 9317782U JP 9317782 U JP9317782 U JP 9317782U JP S58195481 U JPS58195481 U JP S58195481U
Authority
JP
Japan
Prior art keywords
circuit unit
case
electronic equipment
opening
abstract
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9317782U
Other languages
Japanese (ja)
Other versions
JPH0129828Y2 (en
Inventor
弘中　久和
Original Assignee
ミツミ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミツミ電機株式会社 filed Critical ミツミ電機株式会社
Priority to JP9317782U priority Critical patent/JPS58195481U/en
Publication of JPS58195481U publication Critical patent/JPS58195481U/en
Application granted granted Critical
Publication of JPH0129828Y2 publication Critical patent/JPH0129828Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案になる電子装置を示す断面図。、１・・
・・・・電子装置、２・・・・・・ケース、３・・・・
・・回路ユニット、４．５・・・・・・硬化性充填材、
６・・・・・・板材。FIG. 1 is a sectional view showing an electronic device according to the present invention. ,1...
...Electronic device, 2...Case, 3...
...Circuit unit, 4.5...Curable filler,
6...Plate material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 開口部を有するケース内部に、電子部品が装着−された
基板からなる回路ユニットを収納すると共（こ硬化性充
填材を充填させ、該回路ユニットの一部を該ケースの開
口部から突出させて該回路ユニットと該ケースとを一体
的に固定せしめ、該回路ユニットの一部に板材を配した
ことを特徴とする電子装置。A circuit unit consisting of a board on which electronic components are mounted is housed inside a case having an opening (this is filled with a curable filler, and a part of the circuit unit is made to protrude from the opening of the case). An electronic device characterized in that the circuit unit and the case are integrally fixed, and a plate material is arranged on a part of the circuit unit.
JP9317782U 1982-06-21 1982-06-21 electronic equipment Granted JPS58195481U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9317782U JPS58195481U (en) 1982-06-21 1982-06-21 electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9317782U JPS58195481U (en) 1982-06-21 1982-06-21 electronic equipment

Publications (2)

Publication Number Publication Date
JPS58195481U true JPS58195481U (en) 1983-12-26
JPH0129828Y2 JPH0129828Y2 (en) 1989-09-11

Family

ID=30223845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9317782U Granted JPS58195481U (en) 1982-06-21 1982-06-21 electronic equipment

Country Status (1)

Country Link
JP (1) JPS58195481U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002050900A1 (en) * 2000-12-19 2002-06-27 Sony Corporation Electronic circuit device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519628U (en) * 1974-07-08 1976-01-24
JPS519622U (en) * 1974-07-05 1976-01-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519622U (en) * 1974-07-05 1976-01-24
JPS519628U (en) * 1974-07-08 1976-01-24

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002050900A1 (en) * 2000-12-19 2002-06-27 Sony Corporation Electronic circuit device

Also Published As

Publication number Publication date
JPH0129828Y2 (en) 1989-09-11

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