JPS58195482U - electronic equipment - Google Patents

electronic equipment

Info

Publication number
JPS58195482U
JPS58195482U JP9317882U JP9317882U JPS58195482U JP S58195482 U JPS58195482 U JP S58195482U JP 9317882 U JP9317882 U JP 9317882U JP 9317882 U JP9317882 U JP 9317882U JP S58195482 U JPS58195482 U JP S58195482U
Authority
JP
Japan
Prior art keywords
circuit unit
case
curable filler
electronic equipment
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9317882U
Other languages
Japanese (ja)
Inventor
弘中　久和
Original Assignee
ミツミ電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ミツミ電機株式会社 filed Critical ミツミ電機株式会社
Priority to JP9317882U priority Critical patent/JPS58195482U/en
Publication of JPS58195482U publication Critical patent/JPS58195482U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案になる電子装置を示す断面図である。 −１・・・・・・電子装置、２・・・・・・ケース、３
・・・・・・回路ユニット、４・・晶・シリコンゴム、
５・・・・・・エポキシ樹脂、６・・・・・・板材、７
・・・・・・端子。FIG. 1 is a sectional view showing an electronic device according to the present invention. -1...Electronic device, 2...Case, 3
・・・・・・Circuit unit, 4. Crystal silicone rubber,
5... Epoxy resin, 6... Board material, 7
...Terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 開口部を有するケース内部に、電子部品が装着された基
板からなる回路ユニットを収納すると共に硬化性充填材
を充填させ、該回路ユニットを該ケースに一体的に固定
せしめてなる電子装置に於いて、該ケース内部でシリコ
ンゴム等の第１の硬化性充填材が該回路ユニットの電子
部品を保護し、該ケース開口扉をエポキシ樹脂等の接着
性の良い第２の硬化性充填材が塞いでいることを特徴と
する電子装置。In an electronic device in which a circuit unit consisting of a board on which electronic components are mounted is housed inside a case having an opening, the circuit unit is filled with a curable filler, and the circuit unit is integrally fixed to the case. A first curable filler such as silicone rubber protects the electronic components of the circuit unit inside the case, and a second curable filler with good adhesiveness such as epoxy resin closes the case opening door. An electronic device characterized by:
JP9317882U 1982-06-21 1982-06-21 electronic equipment Pending JPS58195482U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9317882U JPS58195482U (en) 1982-06-21 1982-06-21 electronic equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9317882U JPS58195482U (en) 1982-06-21 1982-06-21 electronic equipment

Publications (1)

Publication Number Publication Date
JPS58195482U true JPS58195482U (en) 1983-12-26

Family

ID=30223847

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9317882U Pending JPS58195482U (en) 1982-06-21 1982-06-21 electronic equipment

Country Status (1)

Country Link
JP (1) JPS58195482U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6731001B2 (en) 2000-08-10 2004-05-04 Denso Corporation Semiconductor device including bonded wire based to electronic part and method for manufacturing the same
JP2015130492A (en) * 2013-12-05 2015-07-16 ローム株式会社 semiconductor module

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519628U (en) * 1974-07-08 1976-01-24
JPS519622U (en) * 1974-07-05 1976-01-24

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519622U (en) * 1974-07-05 1976-01-24
JPS519628U (en) * 1974-07-08 1976-01-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6731001B2 (en) 2000-08-10 2004-05-04 Denso Corporation Semiconductor device including bonded wire based to electronic part and method for manufacturing the same
JP2015130492A (en) * 2013-12-05 2015-07-16 ローム株式会社 semiconductor module

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