JPS5926254U - electronic circuit equipment - Google Patents

electronic circuit equipment

Info

Publication number
JPS5926254U
JPS5926254U JP12198882U JP12198882U JPS5926254U JP S5926254 U JPS5926254 U JP S5926254U JP 12198882 U JP12198882 U JP 12198882U JP 12198882 U JP12198882 U JP 12198882U JP S5926254 U JPS5926254 U JP S5926254U
Authority
JP
Japan
Prior art keywords
electronic circuit
resin
frame
semiconductor element
circuit equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12198882U
Other languages
Japanese (ja)
Inventor
勝 神野
孝司 川上
Original Assignee
ロ−ム株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ロ−ム株式会社 filed Critical ロ−ム株式会社
Priority to JP12198882U priority Critical patent/JPS5926254U/en
Publication of JPS5926254U publication Critical patent/JPS5926254U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図はこの考案の実施例を示す断面図、第２図は枠の
斜視図、第３図は他の実施例を示す断面図、第４図は枠
の斜視図、第５図は更に別の実施例に使用する枠の斜視
図である。 １・・・・・・回路基板、２・・・・・・半導体素子、
４．　４Ａ。 ４Ｂ・・・・・・枠、５・・・・・・樹脂。Fig. 1 is a sectional view showing an embodiment of this invention, Fig. 2 is a perspective view of the frame, Fig. 3 is a sectional view showing another embodiment, Fig. 4 is a perspective view of the frame, and Fig. 5 is a perspective view of the frame. FIG. 7 is a perspective view of a frame used in another embodiment. 1... Circuit board, 2... Semiconductor element,
4. 4A. 4B...Frame, 5...Resin.

Claims (2)

【実用新案登録請求の範囲】[Scope of utility model registration request] （１）回路基板の表面に回路素子を装填して構成される
電子回路装置において、前記回路素子のうち樹脂封止す
べき半導体素子の周囲を囲むように枠を前記回路基板の
表面に設置し、前記枠内に封止用の樹脂を充填して前記
枠と回路基板とともに一体化し、前記樹脂によって前記
半導体素子を封止してなる電子回路装置。(1) In an electronic circuit device configured by mounting circuit elements on the surface of a circuit board, a frame is installed on the surface of the circuit board so as to surround a semiconductor element to be resin-sealed among the circuit elements. . An electronic circuit device, wherein the frame is filled with a sealing resin to integrate the frame and a circuit board, and the semiconductor element is sealed with the resin. （２）半導体素子が発光ダイオードであり、かつ樹脂が
透光性である実用新案登録請求の範囲第１項記載の電子
回路装置。(2) The electronic circuit device according to claim 1, wherein the semiconductor element is a light emitting diode and the resin is translucent.
JP12198882U 1982-08-11 1982-08-11 electronic circuit equipment Pending JPS5926254U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12198882U JPS5926254U (en) 1982-08-11 1982-08-11 electronic circuit equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12198882U JPS5926254U (en) 1982-08-11 1982-08-11 electronic circuit equipment

Publications (1)

Publication Number Publication Date
JPS5926254U true JPS5926254U (en) 1984-02-18

Family

ID=30279002

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12198882U Pending JPS5926254U (en) 1982-08-11 1982-08-11 electronic circuit equipment

Country Status (1)

Country Link
JP (1) JPS5926254U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637638A (en) * 1979-09-05 1981-04-11 Yamagata Nippon Denki Kk Manufacturing of semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5637638A (en) * 1979-09-05 1981-04-11 Yamagata Nippon Denki Kk Manufacturing of semiconductor device

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