JPS58187146U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS58187146U JPS58187146U JP8365082U JP8365082U JPS58187146U JP S58187146 U JPS58187146 U JP S58187146U JP 8365082 U JP8365082 U JP 8365082U JP 8365082 U JP8365082 U JP 8365082U JP S58187146 U JPS58187146 U JP S58187146U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- semiconductor equipment
- semiconductor element
- external lead
- envelope
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来装置の外観図、第２図は同装置の断面概要
図、第３図は本考案実施例に係る半導体装置の外観図で
ある。
１．３・・・・・・外部リード、２・・・・・・発光ダ
イオード、４・・・・・・ホトトランジスタ、５・・・
・・・透明樹脂、６・・・・・・外囲体樹脂、７・・・
・・・窪み（穴）、８・・・・・・直線状溝。FIG. 1 is an external view of a conventional device, FIG. 2 is a schematic cross-sectional view of the same device, and FIG. 3 is an external view of a semiconductor device according to an embodiment of the present invention. 1.3... External lead, 2... Light emitting diode, 4... Phototransistor, 5...
...Transparent resin, 6...Envelope resin, 7...
... Depression (hole), 8 ... Linear groove.
Claims (3)
外部リードと、前記半導体素子及び前記外部リードをお
おう外囲体とを有し、前記外囲体上面の一端部に直線状
溝を設けたことを特徴とする半導体装置。(1) It has a semiconductor element, an external lead connected to the semiconductor element, and an envelope covering the semiconductor element and the external lead, and a linear groove is provided at one end of the upper surface of the envelope. A semiconductor device characterized by:
る実用新案登録請求の範囲第１項に記載の半導体装置。(2) The semiconductor device according to claim 1, wherein the linear groove has a cross-sectional shape of a circular arc.
徴とする実用新案登録請求の範囲第１項に記載の半導体
装置。(3) The semiconductor device according to claim 1, wherein the groove has a depth ranging from 0.1 to 1.0 lines.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8365082U JPS58187146U (en) | 1982-06-04 | 1982-06-04 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8365082U JPS58187146U (en) | 1982-06-04 | 1982-06-04 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58187146U true JPS58187146U (en) | 1983-12-12 |
Family
ID=30092643
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8365082U Pending JPS58187146U (en) | 1982-06-04 | 1982-06-04 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58187146U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615529A (en) * | 1984-06-20 | 1986-01-11 | Hitachi Ltd | Insulated semiconductor device |
-
1982
- 1982-06-04 JP JP8365082U patent/JPS58187146U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS615529A (en) * | 1984-06-20 | 1986-01-11 | Hitachi Ltd | Insulated semiconductor device |
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