JPS6092851U - Light emitting part of light emitting diode lamp - Google Patents

Light emitting part of light emitting diode lamp

Info

Publication number
JPS6092851U
JPS6092851U JP18459183U JP18459183U JPS6092851U JP S6092851 U JPS6092851 U JP S6092851U JP 18459183 U JP18459183 U JP 18459183U JP 18459183 U JP18459183 U JP 18459183U JP S6092851 U JPS6092851 U JP S6092851U
Authority
JP
Japan
Prior art keywords
light emitting
emitting diode
diode lamp
base
emitting part
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18459183U
Other languages
Japanese (ja)
Inventor
柴田　善彦
Original Assignee
舶用電球株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 舶用電球株式会社 filed Critical 舶用電球株式会社
Priority to JP18459183U priority Critical patent/JPS6092851U/en
Publication of JPS6092851U publication Critical patent/JPS6092851U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例の斜視図、第２図は第１図の
Ａ−Ａ線截断面図、第３図は本考案の他の実施例の斜視
図、第４図は第３図のＢ−Ｂ線截断面図を示す。 １・・・・・・リード線、２・・・・・・絶縁基台、３
・・・・・・窓、４・・・・・・発光ダイオードチップ
、５・曲・接着部、６・・・・・・主面。FIG. 1 is a perspective view of one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along the line A-A in FIG. 1, FIG. 3 is a perspective view of another embodiment of the present invention, and FIG. 3 is a cross-sectional view taken along line B-B in FIG. 3. 1... Lead wire, 2... Insulated base, 3
...Window, 4...Light emitting diode chip, 5.Curved/adhesive part, 6...Main surface.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] リード線１を絶縁基台２にインサート成型によりモール
ドし、その先端部を該基台２の窓３を介して該基台２の
上下両面に露出させると共に該先端部に発光ダイオード
チップ４を接着してなるものにおいあ、該リード線１の
発光ダイオードチップ４の接着部５を絶縁基板２の主面
６より突出させて形成してなる発光ダイオードランプの
発光部。A lead wire 1 is molded on an insulating base 2 by insert molding, and its tip is exposed on both upper and lower surfaces of the base 2 through a window 3 of the base 2, and a light emitting diode chip 4 is bonded to the tip. The light emitting part of the light emitting diode lamp is formed by making the adhesive part 5 of the light emitting diode chip 4 of the lead wire 1 protrude from the main surface 6 of the insulating substrate 2.
JP18459183U 1983-12-01 1983-12-01 Light emitting part of light emitting diode lamp Pending JPS6092851U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18459183U JPS6092851U (en) 1983-12-01 1983-12-01 Light emitting part of light emitting diode lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18459183U JPS6092851U (en) 1983-12-01 1983-12-01 Light emitting part of light emitting diode lamp

Publications (1)

Publication Number Publication Date
JPS6092851U true JPS6092851U (en) 1985-06-25

Family

ID=30399201

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18459183U Pending JPS6092851U (en) 1983-12-01 1983-12-01 Light emitting part of light emitting diode lamp

Country Status (1)

Country Link
JP (1) JPS6092851U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH028070U (en) * 1988-06-24 1990-01-18

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310288B2 (en) * 1975-02-17 1978-04-12
JPS5360577A (en) * 1976-11-11 1978-05-31 Nec Corp Semiconductor device
JPS582080A (en) * 1981-06-29 1983-01-07 Nippon Denyo Kk Lamp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5310288B2 (en) * 1975-02-17 1978-04-12
JPS5360577A (en) * 1976-11-11 1978-05-31 Nec Corp Semiconductor device
JPS582080A (en) * 1981-06-29 1983-01-07 Nippon Denyo Kk Lamp

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH028070U (en) * 1988-06-24 1990-01-18

Similar Documents

Publication Publication Date Title
JPS6092851U (en) Light emitting part of light emitting diode lamp
JPS6113958U (en) light emitting diode lamp
JPS6073264U (en) light emitting diode lamp
JPS6092852U (en) Light emitting part of lamp
JPS6037261U (en) Heat dissipation structure of light emitting part of light emitting diode lamp
JPS5996858U (en) light emitting element
JPS60106356U (en) light emitting semiconductor device
JPS60133653U (en) light emitting diode
JPS6066057U (en) light emitting diode lamp
JPS6063962U (en) Light emitting diode lamp for automatic insertion
JPS5844863U (en) light emitting diode lamp
JPS58187146U (en) semiconductor equipment
JPS6088571U (en) light emitting diode lamp
JPS60153538U (en) semiconductor element
JPS6039259U (en) light emitting diode lamp
JPS60144258U (en) optical semiconductor device
JPS6049654U (en) Two-color light emitting semiconductor device
JPS618902U (en) Holder structure for light emitting elements
JPS58159763U (en) light emitting diode element
JPS5945964U (en) Parts fixing device
JPS59145070U (en) Light emitting element mounting device
JPS5925167U (en) Jumper unit
JPS5963452U (en) light emitting diode lamp
JPS6022838U (en) semiconductor equipment
JPS59177963U (en) light emitting diode