JPS6037261U - Heat dissipation structure of light emitting part of light emitting diode lamp - Google Patents
Heat dissipation structure of light emitting part of light emitting diode lampInfo
- Publication number
- JPS6037261U JPS6037261U JP12838183U JP12838183U JPS6037261U JP S6037261 U JPS6037261 U JP S6037261U JP 12838183 U JP12838183 U JP 12838183U JP 12838183 U JP12838183 U JP 12838183U JP S6037261 U JPS6037261 U JP S6037261U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- emitting diode
- heat dissipation
- dissipation structure
- diode lamp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は本考案の1実施例の平面図、第2図は第1図■
−■線切断側面図、第3図は裏面図を示す。
IA、IB・・・リード線、2・・・絶縁基台、3・・
・発光ダイオードチップ、4・・・接続ワイヤ、5A、
5B・・・窓、8・・・外部リード線。Figure 1 is a plan view of one embodiment of the present invention, and Figure 2 is the same as Figure 1.
A side view cut along the line -■, and FIG. 3 shows a back view. IA, IB...Lead wire, 2...Insulation base, 3...
・Light-emitting diode chip, 4... Connection wire, 5A,
5B...Window, 8...External lead wire.
Claims (1)
りモールドし、その先端部に発光ダイオードチップ3及
び接続ワイヤ4を各接着するものにおいて、該リード線
IA、IBにおける前記チップ3及び接続ワイヤ4の接
着部の表裏前面を前記絶縁基台2の窓5A、5Bを介し
て各露出させてなる発光ダイオードランプの発光部の放
熱構造。In the case where the lead wires IA and IB are molded on an insulating base 2 by insert molding, and the light emitting diode chip 3 and the connection wire 4 are bonded to the tips of the lead wires IA and IB, the chip 3 and the connection wire 4 in the lead wires IA and IB are bonded. A heat dissipation structure for a light emitting part of a light emitting diode lamp, in which the front and back surfaces of the bonded part are exposed through the windows 5A and 5B of the insulating base 2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12838183U JPS6037261U (en) | 1983-08-22 | 1983-08-22 | Heat dissipation structure of light emitting part of light emitting diode lamp |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12838183U JPS6037261U (en) | 1983-08-22 | 1983-08-22 | Heat dissipation structure of light emitting part of light emitting diode lamp |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6037261U true JPS6037261U (en) | 1985-03-14 |
Family
ID=30291257
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12838183U Pending JPS6037261U (en) | 1983-08-22 | 1983-08-22 | Heat dissipation structure of light emitting part of light emitting diode lamp |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6037261U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH028070U (en) * | 1988-06-24 | 1990-01-18 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5360577A (en) * | 1976-11-11 | 1978-05-31 | Nec Corp | Semiconductor device |
JPS582080A (en) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Lamp |
-
1983
- 1983-08-22 JP JP12838183U patent/JPS6037261U/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5360577A (en) * | 1976-11-11 | 1978-05-31 | Nec Corp | Semiconductor device |
JPS582080A (en) * | 1981-06-29 | 1983-01-07 | Nippon Denyo Kk | Lamp |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH028070U (en) * | 1988-06-24 | 1990-01-18 |
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