JPS6066055U - Package for semiconductor light emitting devices - Google Patents
Package for semiconductor light emitting devicesInfo
- Publication number
- JPS6066055U JPS6066055U JP15764783U JP15764783U JPS6066055U JP S6066055 U JPS6066055 U JP S6066055U JP 15764783 U JP15764783 U JP 15764783U JP 15764783 U JP15764783 U JP 15764783U JP S6066055 U JPS6066055 U JP S6066055U
- Authority
- JP
- Japan
- Prior art keywords
- light emitting
- package
- semiconductor light
- emitting devices
- iox
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図ａ及びｂはそれぞれ従来から知られているフラッ
トパッケージを用いて構成された半導体発光ダイオード
装置の上面図及び中央断面図である。第２図ａ及びｂは
それぞれ本考案のフラットパッケージを用いて構成され
た半導体発光ダイオード装置の上面図及び中央断面図で
ある。
各番号の意味するところは次のとおりである。
１・・・発光ダイオードペレット、２・・・メタライズ
部分、３・・・リード線、４・・・ステム本体、５・・
・取付はネジ、６・・・リードワイヤ、７・・・パッケ
ージ主要部、８・・・アルミナ薄膜、９・・・サブマウ
ント。FIGS. 1A and 1B are a top view and a central sectional view, respectively, of a semiconductor light emitting diode device constructed using a conventionally known flat package. FIGS. 2a and 2b are a top view and a central cross-sectional view, respectively, of a semiconductor light emitting diode device constructed using the flat package of the present invention. The meaning of each number is as follows. 1... Light emitting diode pellet, 2... Metallized part, 3... Lead wire, 4... Stem body, 5...
- Mounting is by screw, 6... Lead wire, 7... Main part of package, 8... Alumina thin film, 9... Submount.
Claims (1)
て電気絶縁性を確保されていて、かつ熱膨張率がＩＯＸ
１０−６α／ ｃｍ ｋ以下の金属からなり、さらに
前記主要部材のうち発光素子ペレットを直上に装着する
部分に熱伝導率が１００Ｗ／ｍｋ以上の材料からなる放
熱用部材が埋設されていることを特徴とする半導体発光
素子用パッケージ。The material of the main components is coated with a thin alumina film to ensure electrical insulation, and the coefficient of thermal expansion is IOX.
10-6α/cm k or less, and furthermore, a heat dissipation member made of a material with a thermal conductivity of 100 W/mk or more is embedded in the part of the main member where the light emitting element pellet is mounted directly above. A package for semiconductor light emitting devices with special features.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15764783U JPS6066055U (en) | 1983-10-11 | 1983-10-11 | Package for semiconductor light emitting devices |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15764783U JPS6066055U (en) | 1983-10-11 | 1983-10-11 | Package for semiconductor light emitting devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6066055U true JPS6066055U (en) | 1985-05-10 |
Family
ID=30347505
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15764783U Pending JPS6066055U (en) | 1983-10-11 | 1983-10-11 | Package for semiconductor light emitting devices |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6066055U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01283985A (en) * | 1988-05-11 | 1989-11-15 | Shinko Electric Ind Co Ltd | Package for mounting light emitting element and manufacture thereof |
-
1983
- 1983-10-11 JP JP15764783U patent/JPS6066055U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01283985A (en) * | 1988-05-11 | 1989-11-15 | Shinko Electric Ind Co Ltd | Package for mounting light emitting element and manufacture thereof |
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