JPS60119752U - integrated circuit package - Google Patents

integrated circuit package

Info

Publication number
JPS60119752U
JPS60119752U JP1984004301U JP430184U JPS60119752U JP S60119752 U JPS60119752 U JP S60119752U JP 1984004301 U JP1984004301 U JP 1984004301U JP 430184 U JP430184 U JP 430184U JP S60119752 U JPS60119752 U JP S60119752U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit package
base
circuit chip
base portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1984004301U
Other languages
Japanese (ja)
Inventor
後藤　昭男
Original Assignee
三菱電機株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 三菱電機株式会社 filed Critical 三菱電機株式会社
Priority to JP1984004301U priority Critical patent/JPS60119752U/en
Publication of JPS60119752U publication Critical patent/JPS60119752U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Casings For Electric Apparatus (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の放熱体つきの集積回路パッケージの断面
図、第２図はこの考案の一実施例による集積回路パッケ
ージの断面図、第３図は第２図のパッケージの斜視図、
第４図は第２図のパッケージにおける熱良導体からなる
ベース部材の斜視図である。 図において、１０はパッケージ、１２は集積回路チップ
、１４はベース部、１６は天井部、１８は放熱体、２０
はリード線、２２はボンディングワイヤ、１０Ａはベー
ス部材、１０Ｂは天井部材、２４は柱状部である。なお
、各図中の同一符号は同一または相当部分を示すものと
する。FIG. 1 is a sectional view of a conventional integrated circuit package with a heat sink, FIG. 2 is a sectional view of an integrated circuit package according to an embodiment of the invention, and FIG. 3 is a perspective view of the package of FIG.
4 is a perspective view of a base member made of a good thermal conductor in the package of FIG. 2. FIG. In the figure, 10 is a package, 12 is an integrated circuit chip, 14 is a base part, 16 is a ceiling part, 18 is a heat sink, 20
22 is a lead wire, 22 is a bonding wire, 10A is a base member, 10B is a ceiling member, and 24 is a columnar portion. Note that the same reference numerals in each figure indicate the same or corresponding parts.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 集積回路チップが固着されるベース部と、このベース部
と対向して上記集積回路チップの収容空間を形成する天
井部の外面側に取付けられた放熱体とを有する集積回路
パッケージであって、上記ベース部と、このベース部と
上記放熱体とを結合する部分とを含んだ構成体の一部が
、残る他の構成体より熱伝導率の高い材料で形成されて
いることを特徴とする集積回路パッケージ。An integrated circuit package having a base portion to which an integrated circuit chip is fixed, and a heat radiator attached to the outer surface side of a ceiling portion facing the base portion and forming a housing space for the integrated circuit chip, An integrated structure characterized in that a part of the structure including a base part and a part connecting the base part and the heat sink is formed of a material having higher thermal conductivity than the remaining parts of the structure. circuit package.
JP1984004301U 1984-01-17 1984-01-17 integrated circuit package Pending JPS60119752U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1984004301U JPS60119752U (en) 1984-01-17 1984-01-17 integrated circuit package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1984004301U JPS60119752U (en) 1984-01-17 1984-01-17 integrated circuit package

Publications (1)

Publication Number Publication Date
JPS60119752U true JPS60119752U (en) 1985-08-13

Family

ID=30479736

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1984004301U Pending JPS60119752U (en) 1984-01-17 1984-01-17 integrated circuit package

Country Status (1)

Country Link
JP (1) JPS60119752U (en)

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