JPS60939U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS60939U
JPS60939U JP9238883U JP9238883U JPS60939U JP S60939 U JPS60939 U JP S60939U JP 9238883 U JP9238883 U JP 9238883U JP 9238883 U JP9238883 U JP 9238883U JP S60939 U JPS60939 U JP S60939U
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor element
lead
semiconductor equipment
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9238883U
Other languages
Japanese (ja)
Inventor
健太郎 村上
Original Assignee
日本電気ホームエレクトロニクス株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気ホームエレクトロニクス株式会社 filed Critical 日本電気ホームエレクトロニクス株式会社
Priority to JP9238883U priority Critical patent/JPS60939U/en
Publication of JPS60939U publication Critical patent/JPS60939U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例の横断面図、第２図は第１図の側断面図
、第３図は支持部材部分の断面図、第４図は本案の一実
施例を示す横断面図、第５図は第４図の側断面図、第６
図はリードフレームの平面図、第７図は本案の他の実施
例を示す側断面図である。 図中、１，１□は放熱板、２はリード、２．〜２７はリ
ード片、３は半導体素子、４は金属細線、５は樹脂材で
ある。FIG. 1 is a cross-sectional view of a conventional example, FIG. 2 is a side cross-sectional view of FIG. 1, FIG. 3 is a cross-sectional view of a supporting member portion, and FIG. Figure 5 is a side sectional view of Figure 4, and Figure 6 is a side sectional view of Figure 4.
The figure is a plan view of the lead frame, and FIG. 7 is a side sectional view showing another embodiment of the present invention. In the figure, 1, 1□ is a heat sink, 2 is a lead, 2. -27 are lead pieces, 3 is a semiconductor element, 4 is a thin metal wire, and 5 is a resin material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 放熱板の表面に半導体素子を固定すると共に、半導体素
子の電極と一端が半導体素子の近傍に位置するように配
置した複数のリード片よりなるリードとを金属細線にて
接続し、かつ半導体素子、放熱板の裏面を含む主要部分
を樹脂材にてモールド被覆したものにおいて、上記放熱
板とリードとを同一金属板から放熱板と特定のリード片
とが一体的に連結されるように打抜加工すると共に、放
熱板をリードより厚肉に形成したことを特徴とする半導
体装置。A semiconductor element is fixed on the surface of a heat sink, and an electrode of the semiconductor element is connected to a lead made of a plurality of lead pieces arranged so that one end is located near the semiconductor element with a thin metal wire, and the semiconductor element is In a case where the main parts of the heat sink, including the back surface, are molded and covered with a resin material, the heat sink and the leads are punched out of the same metal plate so that the heat sink and a specific lead piece are integrally connected. In addition, a semiconductor device characterized in that a heat sink is formed thicker than a lead.
JP9238883U 1983-06-15 1983-06-15 semiconductor equipment Pending JPS60939U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9238883U JPS60939U (en) 1983-06-15 1983-06-15 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9238883U JPS60939U (en) 1983-06-15 1983-06-15 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS60939U true JPS60939U (en) 1985-01-07

Family

ID=30222571

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9238883U Pending JPS60939U (en) 1983-06-15 1983-06-15 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS60939U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028149A (en) * 2005-05-30 2010-02-04 Samsung Electro-Mechanics Co Ltd Method of manufacturing high power led package
JP2015170787A (en) * 2014-03-10 2015-09-28 新電元工業株式会社 Resin-sealed semiconductor device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128679A (en) * 1973-04-09 1974-12-10
JPS5339067A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Production of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49128679A (en) * 1973-04-09 1974-12-10
JPS5339067A (en) * 1976-09-22 1978-04-10 Hitachi Ltd Production of semiconductor device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010028149A (en) * 2005-05-30 2010-02-04 Samsung Electro-Mechanics Co Ltd Method of manufacturing high power led package
JP2015170787A (en) * 2014-03-10 2015-09-28 新電元工業株式会社 Resin-sealed semiconductor device

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