JPS59192846U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59192846U
JPS59192846U JP8717883U JP8717883U JPS59192846U JP S59192846 U JPS59192846 U JP S59192846U JP 8717883 U JP8717883 U JP 8717883U JP 8717883 U JP8717883 U JP 8717883U JP S59192846 U JPS59192846 U JP S59192846U
Authority
JP
Japan
Prior art keywords
lead
semiconductor equipment
semiconductor device
covered
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8717883U
Other languages
Japanese (ja)
Inventor
吉田　全男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP8717883U priority Critical patent/JPS59192846U/en
Publication of JPS59192846U publication Critical patent/JPS59192846U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例による半導体装置の透視図を
、第２図は外部導出リード部を拡大した図を示すもので
、同図ａは平面図、同図すは側面図である。 １・・・・・・モールド樹脂、２・・・・・・外部導出
リード、３・・・・・・外部導出リード側面の溝部、５
・・・・・・半導体ペレット、６・・・・・・金属細線
、７・・・・・・放熱板。FIG. 1 is a perspective view of a semiconductor device according to an embodiment of the present invention, and FIG. 2 is an enlarged view of an external lead portion, where a is a plan view and a is a side view. . 1...Mold resin, 2...External lead-out lead, 3...Groove on the side surface of external lead-out lead, 5
... Semiconductor pellet, 6 ... Fine metal wire, 7 ... Heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレットの各電極と外部導出リードとを金属細線
にて接続し、かつ半導体＾レットを含む、　　主要部分
を樹脂材にてモールド被覆した半導体装置に於いて、上
記モールド被覆された部分の外部導出リードに凹形の側
溝を設けたことを特徴とする半導体装置。１In a semiconductor device in which each electrode of a semiconductor pellet and an external lead-out lead are connected by a thin metal wire, and the main part including the semiconductor pellet is mold-covered with a resin material, the above-mentioned mold-covered part is led out to the outside. A semiconductor device characterized in that a concave side groove is provided in a lead. 1
JP8717883U 1983-06-08 1983-06-08 semiconductor equipment Pending JPS59192846U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8717883U JPS59192846U (en) 1983-06-08 1983-06-08 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8717883U JPS59192846U (en) 1983-06-08 1983-06-08 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59192846U true JPS59192846U (en) 1984-12-21

Family

ID=30217092

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8717883U Pending JPS59192846U (en) 1983-06-08 1983-06-08 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59192846U (en)

Similar Documents

Publication Publication Date Title
JPS5827934U (en) semiconductor equipment
JPS596839U (en) semiconductor equipment
JPS59192846U (en) semiconductor equipment
JPS5933254U (en) semiconductor equipment
JPS59192845U (en) semiconductor equipment
JPS58144855U (en) semiconductor equipment
JPS5881937U (en) semiconductor equipment
JPS605147U (en) semiconductor equipment
JPS60939U (en) semiconductor equipment
JPS594644U (en) Resin mold semiconductor device
JPS59191744U (en) semiconductor equipment
JPS60153543U (en) Lead frame for semiconductor devices
JPS5989547U (en) semiconductor equipment
JPS6037253U (en) semiconductor equipment
JPS588954U (en) semiconductor equipment
JPS6068654U (en) semiconductor equipment
JPS58155836U (en) semiconductor equipment
JPS60113642U (en) semiconductor equipment
JPS6071146U (en) semiconductor equipment
JPS59192850U (en) semiconductor equipment
JPS5991747U (en) semiconductor equipment
JPS6094836U (en) semiconductor equipment
JPS6113940U (en) semiconductor equipment
JPS59191742U (en) semiconductor equipment
JPS5889946U (en) semiconductor equipment