JPS59192845U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS59192845U
JPS59192845U JP8717783U JP8717783U JPS59192845U JP S59192845 U JPS59192845 U JP S59192845U JP 8717783 U JP8717783 U JP 8717783U JP 8717783 U JP8717783 U JP 8717783U JP S59192845 U JPS59192845 U JP S59192845U
Authority
JP
Japan
Prior art keywords
semiconductor equipment
external lead
covered
semiconductor
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8717783U
Other languages
Japanese (ja)
Inventor
吉田　全男
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP8717783U priority Critical patent/JPS59192845U/en
Publication of JPS59192845U publication Critical patent/JPS59192845U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/10155—Shape being other than a cuboid

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例による半導体装置の構造の平
面透視図を示し、第２図はその側面図を示す。 １・・・・・・樹脂モールド被覆部、２・・・・・・モ
ールド被覆部の外部リード部、３・・・・・・モールド
被覆部の外部リード穴部、４・・・・・・各外部リード
、５・・・・・・半導体ペレット、６・・・・・・金属
細線、７・・・・・・放熱板。FIG. 1 shows a plan perspective view of the structure of a semiconductor device according to an embodiment of the present invention, and FIG. 2 shows a side view thereof. 1... Resin mold covering part, 2... External lead part of mold covering part, 3... External lead hole part of mold covering part, 4... Each external lead, 5...semiconductor pellet, 6... thin metal wire, 7... heat sink.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレットの各電極と外部リードとを金属細線にて
接続し、かつ半導体ペレットを含む主要部分を樹脂材に
てモールド被覆した半導体装置に於いて、上記モールド
被覆された部分の外部リードに貫通する穴を設けたこと
を特徴とする半導体装置。In a semiconductor device in which each electrode of a semiconductor pellet and an external lead are connected with a thin metal wire, and the main part including the semiconductor pellet is molded and covered with a resin material, the part that is covered with the mold is penetrated by the external lead. A semiconductor device characterized by having a hole.
JP8717783U 1983-06-08 1983-06-08 semiconductor equipment Pending JPS59192845U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8717783U JPS59192845U (en) 1983-06-08 1983-06-08 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8717783U JPS59192845U (en) 1983-06-08 1983-06-08 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS59192845U true JPS59192845U (en) 1984-12-21

Family

ID=30217091

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8717783U Pending JPS59192845U (en) 1983-06-08 1983-06-08 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS59192845U (en)

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