JPS5933254U - semiconductor equipment - Google Patents
semiconductor equipmentInfo
- Publication number
- JPS5933254U JPS5933254U JP12988582U JP12988582U JPS5933254U JP S5933254 U JPS5933254 U JP S5933254U JP 12988582 U JP12988582 U JP 12988582U JP 12988582 U JP12988582 U JP 12988582U JP S5933254 U JPS5933254 U JP S5933254U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor element
- semiconductor equipment
- heat sink
- resin material
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来例の平面図、第２図は第１図の側断面図、
第３図は本案の一実施例を示す平面図、第４図は第３図
のＩ−Ｉ断面図である。
図中、１は放熱板、２は貫通孔、３は半導体素子、４は
リード、６は樹脂材である。Figure 1 is a plan view of the conventional example, Figure 2 is a side sectional view of Figure 1,
FIG. 3 is a plan view showing an embodiment of the present invention, and FIG. 4 is a sectional view taken along line II in FIG. In the figure, 1 is a heat sink, 2 is a through hole, 3 is a semiconductor element, 4 is a lead, and 6 is a resin material.
Claims (1)
極とリードとを電気的に接続し、かつ半導体素子を含む
主要部分を樹脂材にてモールド被覆したものにおいて、
上記放熱板の樹脂材より露呈する領域に貫通孔を形成し
たことを特徴とする半導体装置。A semiconductor element is fixed to a heat sink, the electrodes and leads of the semiconductor element are electrically connected, and the main part including the semiconductor element is molded and covered with a resin material,
A semiconductor device characterized in that a through hole is formed in a region exposed from a resin material of the heat sink.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12988582U JPS5933254U (en) | 1982-08-27 | 1982-08-27 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12988582U JPS5933254U (en) | 1982-08-27 | 1982-08-27 | semiconductor equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5933254U true JPS5933254U (en) | 1984-03-01 |
Family
ID=30294152
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12988582U Pending JPS5933254U (en) | 1982-08-27 | 1982-08-27 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5933254U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6289977U (en) * | 1985-11-22 | 1987-06-09 | ||
| JPS6395468U (en) * | 1986-12-10 | 1988-06-20 |
-
1982
- 1982-08-27 JP JP12988582U patent/JPS5933254U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6289977U (en) * | 1985-11-22 | 1987-06-09 | ||
| JPS6395468U (en) * | 1986-12-10 | 1988-06-20 |
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