JPS599553U - semiconductor equipment - Google Patents

semiconductor equipment

Info

Publication number
JPS599553U
JPS599553U JP10423182U JP10423182U JPS599553U JP S599553 U JPS599553 U JP S599553U JP 10423182 U JP10423182 U JP 10423182U JP 10423182 U JP10423182 U JP 10423182U JP S599553 U JPS599553 U JP S599553U
Authority
JP
Japan
Prior art keywords
resin
semiconductor equipment
heat sink
metal plate
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10423182U
Other languages
Japanese (ja)
Inventor
隆司 伊藤
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP10423182U priority Critical patent/JPS599553U/en
Publication of JPS599553U publication Critical patent/JPS599553U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来の半導体装置を示す斜視図、第２図はその
断面図である。第３図は本考案の一実施例を示す斜視図
、第４図はその断面図である。第５図は他の実施例の断
面図である。 １・・・・・・放熱板、２・・・・・・半導体素子、３
・・・・・・外部導出端子、４・・・・・・樹脂、５・
・・・・・金属板。FIG. 1 is a perspective view showing a conventional semiconductor device, and FIG. 2 is a sectional view thereof. FIG. 3 is a perspective view showing an embodiment of the present invention, and FIG. 4 is a sectional view thereof. FIG. 5 is a sectional view of another embodiment. 1... Heat sink, 2... Semiconductor element, 3
...External lead-out terminal, 4...Resin, 5.
...Metal plate.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体素子を載置した金属板が放熱板として露出した樹
脂封止型半導体装置において、樹脂を介して放熱板と相
対した場所に電気的に絶縁された金属板があり、これら
が同時に樹脂封止されていることを特徴とする半導体装
置。In a resin-sealed semiconductor device in which a metal plate on which a semiconductor element is mounted is exposed as a heat sink, there is an electrically insulated metal plate opposite the heat sink through the resin, and these are simultaneously resin-sealed. A semiconductor device characterized by:
JP10423182U 1982-07-09 1982-07-09 semiconductor equipment Pending JPS599553U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10423182U JPS599553U (en) 1982-07-09 1982-07-09 semiconductor equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10423182U JPS599553U (en) 1982-07-09 1982-07-09 semiconductor equipment

Publications (1)

Publication Number Publication Date
JPS599553U true JPS599553U (en) 1984-01-21

Family

ID=30244827

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10423182U Pending JPS599553U (en) 1982-07-09 1982-07-09 semiconductor equipment

Country Status (1)

Country Link
JP (1) JPS599553U (en)

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